MPN: HBM3E 12-Hi 36GB
SK hynix HBM3E 12-High 36GB
36 GB / 12-Hi

9.6 Gbps pin speed · MR-MUF · volume production

Specifications

Capacity

36 GB per placement

Stack Height

12-layer (12-Hi)

Pin Speed

9.6 Gbps

Packaging

MR-MUF

Die Technology

TSV, 3 GB DRAM dies x12

Height

Same as 8-Hi generation

Application

NVIDIA H200 / Blackwell class

MPN

HBM3E 12-Hi 36GB

Overview

NVIDIA H200 / Blackwell accelerators, ultra-high-end AI servers

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