Specifications

Capacity

36GB

Bandwidth

1,280 GB/s

Stack

12-high (TSV)

Technology

TC NCF

Height

Same as 8-high

Target

AI accelerators / HBM3E GPUs

Application

Samsung HBM3E 12H provides 36GB per stack for next-gen AI accelerators and GPU memory subsystems. QS Compute sources HBM3E 12H for AI GPU board assembly and accelerator prototyping.

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