Specifications

Product

Micron HBM4 12-high (12-H)

Capacity

36 GB per stack

Stack Height

12-high

Interface

2,048-bit (twice HBM3E)

Pin Speed

>11 Gb/s

Bandwidth per Stack

>2.8 TB/s

Bandwidth Gain

≈2.3× Micron HBM3E 12-high

Power Efficiency

>20 % better pJ/bit than HBM3E at similar speeds

Channels / Pseudo-channels

32 / 64 (doubled parallelism)

Banks per Die

256 (double HBM3E's 128)

DRAM Process

Micron 1β (1-beta)

Base Die

Logic base die from TSMC (12FFC+ / N5 class)

First Platform

NVIDIA Vera Rubin

Production Status

High-volume production since Q1 2026

Next Density

48 GB 16-high sampling to customers

Successor

HBM4E — expected 2027, TSMC base die + 1γ DRAM

Role

AI / HPC accelerators — not a DIMM replacement

Compliance

JEDEC HBM4

Lead Time

Allocation based — contact for availability

MOQ

Contact for allocation

Overview

Micron's 36 GB 12-high HBM4 is the shipping 2026 generation of high-bandwidth memory for AI and HPC accelerators. It doubles the bus width to 2,048 bits and pushes pin speed past 11 Gb/s, producing more than 2.8 TB/s of bandwidth from a single stack — roughly 2.3× the equivalent 12-high HBM3E.

The efficiency gain is as important as the bandwidth: more than 20 % better pJ/bit means the same data movement costs measurably less power, which is what makes sustained inference at 1,000 W+ accelerator power budgets thermally feasible.

Micron reached high-volume production in the first quarter of 2026, aligned to NVIDIA's Vera Rubin platform, with 48 GB 16-high samples following for higher-capacity accelerators.

Key Benefits

2,048-bit interface — double HBM3E bus width; >2.8 TB/s per stack at >11 Gb/s pin speed; >20 % better pJ/bit for lower thermal cost at the same bandwidth; in volume production for NVIDIA Vera Rubin rather than sampling.

Applications

HBM4 is the memory tier for AI training and inference accelerators, HPC vector engines and any ASIC where model weights must sit within a few hundred nanoseconds of the compute die. It is not a substitute for DDR5 RDIMM capacity.

Request a Quote — MICRON HBM4 36 GB 12-HI — 2,048-BIT, >2.8 TB/S STACK MEMORY

QS Compute — global B2B supply of AI computing hardware, edge AI systems and accelerators. Volume pricing, 15-day sample lead time.

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Related Products

Micron HBM4 12-Hi 36 GB Micron HBM4 16-Hi 48 GB SK hynix HBM4 16-Hi 48 GB