PolarFire SoC device with a quad-core 64-bit RISC-V application cluster and 250K logic elements, in the high-I/O 1152-ball flip-chip package, industrial temperature grade.
MPFS250T-1FCG1152I
Microchip PolarFire SoC MPFS250T FPGA SoC, FCG1152 package
MPFS250T (PolarFire SoC)
Microchip PolarFire SoC
250K
Quad-core 64-bit RISC-V (RV64GC) application cluster + E24 monitor core
FCG1152 (flip-chip, 1152-ball)
Industrial (I)
Flash-based FPGA fabric — instant-on, low static power, immune to configuration SEU
I/O-heavy industrial, communications and defence boards
Evaluation kit
AMD (Xilinx)
AMD Vivado / Vitis unified software platform
MPFS250T-1FCG1152I is the same 250K-logic-element PolarFire SoC device as the 484-ball version, in the larger 1152-ball flip-chip package, which brings out the full set of transceiver, I/O and memory interfaces for boards that need maximum fan-out. The architecture is unchanged: quad-core 64-bit RISC-V application cluster plus an E24 monitor core, flash-based FPGA fabric with hard math blocks, integrated DDR4/LPDDR4 controller and multi-gigabit transceivers. Choose the 1152-ball package when the design must expose all SERDES and I/O banks; use the 484-ball part when board area and layer count dominate.
Part number MPFS250T-1FCG1152I. Contact sherry@qscompute.com for silicon availability, speed grades and pricing.
Need Microchip PolarFire SoC MPFS250T FPGA SoC, FCG1152 package?
Contact sherry@qscompute.com for pricing, configuration, and availability.
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