Specifications
Product
Qualcomm Dragonwing Q-2390 processor
Series
Q2 Series (Dragonwing IoT portfolio)
Process node
11 nm LP (CQ2390S chipset)
Processing
Quad-core application processing + real-time control
AI
On-device AI and machine-vision acceleration
Networking
Dual Gigabit Ethernet with Time-Sensitive Networking (TSN)
Real-time core
Dedicated real-time RISC-V MCU
Temperature range
-30 °C to +115 °C
Package
Industrial 0.8 mm ball-pitch package
Interfaces
PCIe Gen2, USB 3.1, USB 2.0, serial, audio
Software
Qualcomm Linux (Yocto), Android, RTOS / Zephyr
Longevity
Qualcomm Product Longevity Program for IoT
Target apps
Industrial HMIs, PLCs, gateways, machine vision, building and energy control
MPN
Q-2390
Overview
The Qualcomm Dragonwing Q-2390 is a Q2-series industrial edge AI processor built on an 11 nm LP process node. It combines quad-core application processing, on-device AI and machine vision, dual Gigabit Ethernet with Time-Sensitive Networking, and a dedicated real-time RISC-V MCU in a single ruggedised package.
Introduced alongside the IQ-2390 as part of Qualcomm's expanded Dragonwing portfolio, the Q-2390 targets compact, cost-optimised systems — industrial HMIs, PLCs, gateways, machine-vision cameras, building-automation and energy-controls — with operation across -30 °C to +115 °C and coverage under the Qualcomm Product Longevity Program.
Key Benefits
On-device AI + vision + real-time control in one SoC. TSN-capable dual Gigabit Ethernet for deterministic industrial networking. Long-life industrial package with -30 °C to +115 °C range.
Applications
Industrial HMI and control panels, programmable logic controllers (PLCs), intelligent gateways, machine-vision systems, building-automation and energy / EVSE control platforms.
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