Specifications
Product Family
Qualcomm Dragonwing IQ2 Series (first member)
Companion Part
Dragonwing Q-2390 (Q2 Series, commercial and consumer edge)
Application CPU
Quad-core Qualcomm Kryo CPU
GPU
Qualcomm Adreno 704 GPU
Real-Time MCU
Integrated RISC-V MCU for deterministic control
Networking
Dual Gigabit Ethernet with Time-Sensitive Networking (TSN)
Operating Temperature
−30 °C to +115 °C extended industrial range
Ruggedization
Engineered for vibration- and shock-prone environments
Operating Systems
Linux, Android and Zephyr OS
AI Capability
On-device AI acceleration plus machine-vision processing
Integrated I/O
Flexible wired and wireless connectivity, camera and display support
Target Systems
Smart HMIs, PLCs, gateways, industrial vision systems
Target Sectors
Industrial automation, energy, utilities, oil & gas, building automation
Q-2390 Extras
LTE Cat 4, GPS location, retail POS/kiosk and smart-appliance fit
Module Ecosystem
Fibocom SC236 smart module under development on the Q-2390
Portfolio Position
Complements Dragonwing IQ10, IQX, IQ9, IQ8 and IQ6 Series
Integration Benefit
Reduced bill of materials, board space and integration complexity
Announced
September 2026, ahead of IFA 2026
Overview
The Qualcomm Dragonwing IQ-2390 is the first processor in the new Dragonwing IQ2 Series, an industrial edge AI family that extends Qualcomm's intelligent-computing portfolio to a broader range of industrial and compute applications. It sits alongside the existing Dragonwing IQ10, IQX, IQ9, IQ8 and IQ6 Series and is designed to bring AI-enabled industrial systems to market with less design complexity.
Unlike the commercial-and-consumer-oriented Dragonwing Q-2390 released at the same time, the IQ-2390 is built for the factory floor and the field. It combines application processing, machine vision and AI acceleration with dual Gigabit Ethernet featuring Time-Sensitive Networking, and it is rated for an extended −30 °C to +115 °C operating range with features for environments subject to vibration and shock.
Both processors share a quad-core Qualcomm Kryo CPU, a Qualcomm Adreno 704 GPU, an integrated real-time RISC-V MCU and support for Linux, Android and Zephyr. For system integrators the value is a ruggedized, cost-optimized platform for smart HMIs, PLCs, gateways, industrial vision and building automation that consolidates AI, vision, networking and real-time control onto one device.
Key Benefits
Deterministic industrial networking from dual Gigabit Ethernet with TSN; extended-temperature ruggedization from −30 °C to +115 °C with vibration and shock tolerance; on-device AI and vision for inspection, HMI and gateway workloads; real-time control from an integrated RISC-V MCU; and one platform, three OSes with Linux, Android and Zephyr support that lowers BOM cost and board space.
Applications
Smart industrial HMIs and operator panels; PLCs and industrial gateways; industrial machine-vision systems; building automation controllers; energy management and smart-grid equipment; oil & gas and utility monitoring; factory automation and robotics; plus retail POS, kiosks and access control on the companion Dragonwing Q-2390.
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