Specifications
Vendor
Montage Technology
M88DR5RCD01
Gen1 DDR5 RCD — 4800 MT/s — DDR5 RDIMM and LRDIMM
M88DR5RCD02
Gen2 DDR5 RCD — 5600 MT/s — DDR5 RDIMM
M88DR5RCD03
Gen3 DDR5 RCD — 6400 MT/s — DDR5 RDIMM
M88DR5RCD04
Gen4 DDR5 RCD — 7200 MT/s — DDR5 RDIMM (current top bin)
M88DR5DB01
Gen1 DDR5 DB (data buffer) — 4800 MT/s — DDR5 LRDIMM
M88P5010 / M88P5000
DDR5 PMIC — module power management IC for DDR5 RDIMM and LRDIMM
M88SPD5118
DDR5 SPD Hub — MRDIMM/MCRDIMM, RDIMM, LRDIMM, UDIMM, SODIMM, CUDIMM, CSODIMM, CAMM, LPCAMM and SOCAMM
M88TS5110
DDR5 temperature sensor — MRDIMM/MCRDIMM, RDIMM and LRDIMM
RCD Role
Buffers and re-drives the address, command and clock bus on a registered DIMM
DB Role
Buffers the data bus on load-reduced DIMMs to cut electrical load per rank
Speed Ladder
4800 → 5600 → 6400 → 7200 MT/s across four RCD generations
Module Types Supported
DDR5 RDIMM, LRDIMM, MRDIMM/MCRDIMM, UDIMM, SODIMM, CUDIMM, CSODIMM, CAMM, LPCAMM, SOCAMM
Design Intent
Single-vendor chipset for a complete DDR5 server module BOM
Compliance Path
JEDEC DDR5 module architectures; Montage publishes a per-part product brief
Availability
Contact for quote — mixed-part BOMs and volume pricing on request
Overview
Every registered DDR5 server module carries a small constellation of support silicon, and Montage Technology supplies all of it. The M88DR5RCD family is the registered clock driver line: four generations that track the JEDEC DDR5 speed bins from 4800 MT/s on the Gen1 M88DR5RCD01 through 5600, 6400 and finally 7200 MT/s on the Gen4 M88DR5RCD04. The RCD buffers and re-drives the address, command and clock bus so a fully populated server can carry many ranks without the memory controller running out of drive strength.
The M88DR5DB01 is the matching data buffer for load-reduced DIMMs, where the data bus is buffered per rank to reduce electrical load; DDR5 LRDIMMs use DB while MRDIMMs use the multiplexed MDB. The M88P5010 / M88P5000 family provides module-level power management as required by the DDR5 architecture, and the M88SPD5118 SPD hub carries the module's serial-presence-detect data across essentially every DDR5 form factor Montage lists — MRDIMM, RDIMM, LRDIMM, UDIMM, SODIMM, CUDIMM, CSODIMM, CAMM, LPCAMM and SOCAMM. The M88TS5110 temperature sensor rounds out thermal telemetry for MRDIMM/MCRDIMM, RDIMM and LRDIMM.
Sourcing the RCD, DB, PMIC, SPD hub and thermal sensor from one vendor simplifies a module OEM's qualification effort and keeps the inter-generation migration predictable: a design moving from DDR5-5600 to DDR5-6400 swaps RCD02 for RCD03 without touching the rest of the BOM.
QS Compute supplies the Montage DDR5 interface chipset alongside the Micron, Samsung and SK hynix DRAM that assemblers build these modules around — useful when a memory line is being re-spun for a higher speed bin and the support silicon has to move first.
Key Benefits
One vendor for the whole module BOM — RCD, data buffer, PMIC, SPD hub and temperature sensor. Four RCD generations covering 4800 to 7200 MT/s for a clean speed-bin upgrade path. Widest form-factor reach — the M88SPD5118 covers twelve DDR5 module standards including CAMM, LPCAMM and SOCAMM. Per-part product briefs supplied with quotes for design-in documentation.
Applications
DDR5 RDIMM/LRDIMM/MRDIMM module designs · server memory-module ODM programmes · AI and general-purpose server memory subsystems · SOCAMM/CAMM/LPCAMM design-in · memory speed-bin upgrades on existing module designs
Request a Quote — MONTAGE DDR5 SERVER DIMM CHIPSET — M88DR5RCD01-04 RCD, M88DR5DB01 DB, PMIC, SPD HUB, TS
QS Compute — global B2B supply of AI computing hardware, edge AI systems and accelerators. Volume pricing, 15-day sample lead time.
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