Specifications
12 Amp Voltage Regulator
P2815Gxx — main voltage regulator for Server SOCAMM2 modules
3 Amp Voltage Regulator
P2813Gxx — auxiliary voltage regulator for Server SOCAMM2 modules
SPD Hub
SPD1605Gxx serial presence detect hub with internal temperature sensor
SPD Hub Applications
Server SOCAMM2, server RDIMM and server MRDIMM modules
Module Standard
SOCAMM2 — Small Outline Compression Attach Memory Module Gen 2
DRAM Type
LPDDR5X-based server memory modules
Peak Speed
Up to 9600 MT/s in a server-class LPDDR-based compression-attached module
Form Factor Benefit
Module-based serviceability and reliability with LPDDR5X power and bandwidth characteristics
Primary Platform
AI server platforms using compression attach memory
Telemetry
Module temperature reported through the SPD hub for platform thermal management
Companion Portfolio
Rambus DDR5 RDIMM and MRDIMM chipsets cover the alternative DIMM paths in the same server
Vendor
Rambus memory interface chip family — three decades of high-performance memory interface silicon
Overview
SOCAMM2 (Small Outline Compression Attach Memory Module Gen 2) brings the power efficiency and bandwidth density of LPDDR5X to a socketed, serviceable server module. The form factor depends on interface silicon that is very different from a classic RDIMM: there is no registering clock driver, but the module still needs tightly specified on-module voltage regulation and an SPD hub that reports identity and temperature to the platform.
Rambus supplies exactly that pair. The P2815Gxx 12 A voltage regulator handles the module's main rail and the P2813Gxx 3 A regulator covers auxiliary rails, while the SPD1605Gxx SPD hub with internal temperature sensor provides the sideband interface the server uses to identify the module and monitor its thermal state. The chipset is qualified for server SOCAMM2 modules and supports operation up to 9600 MT/s.
For AI servers where every watt and every millimetre of board area matters, SOCAMM2 modules built with this chipset offer LPDDR5X efficiency in a compression-attach package that can be assembled and replaced, rather than a permanently soldered memory-down design. The same SPD1605Gxx part is also used on Rambus DDR5 RDIMM and MRDIMM chipsets, which simplifies platform-level sideband management across memory types.
Key Benefits
Purpose-built for SOCAMM2: regulators and SPD hub specified together for the LPDDR5X module form factor. Higher density rails: 12 A main regulator plus 3 A auxiliary regulator. Integrated telemetry: SPD hub with internal temperature sensor. Platform consistency: the same SPD1605Gxx hub is used across SOCAMM2, RDIMM and MRDIMM chipset families.
Applications
AI server memory subsystems, SOCAMM2 module manufacturing, LPDDR5X-based compression attach memory designs, high-density inference server platforms, and memory module validation and thermal characterisation.
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