Specifications

Form Factor

System-on-module plus carrier board development kit

System-on-Module

Thundercomm TurboX C7790

SoC

Qualcomm Dragonwing Q-7790 (CQ7790S), 4 nm process

CPU

Octa-core Kryo up to 2.8 GHz (1x Gold+ core @ 2.8 GHz)

GPU

Qualcomm Adreno 722 @ up to 1.15 GHz

AI Acceleration

24 TOPS INT8 - NSP3, 8K HMX, 4x HVX

Audio DSP

LPASS with embedded eNPU5, always-on subsystem

System Memory

12 GB LPDDR5X

Storage

128 GB onboard flash (UFS / eMMC / NAND)

Video Decode

4K120 H.264 / H.265 / AV1

Video Encode

4K60 H.264 / H.265

Camera

3x 4-lane D-PHY connectors, triple ISP (21MP + 21MP + 21MP)

Display Outputs

DisplayPort over USB Type-C, MIPI DSI connector, HDMI OUT1

Networking

2x 1000M Gigabit Ethernet RJ45

Wireless

Optional Wi-Fi and Bluetooth via M.2 E-Key socket

USB

4x USB 3.0 Type-A, plus USB Type-C debug with UART

Expansion

M.2 M-Key for NVMe SSD, M.2 E-Key for Wi-Fi/BT

Audio

3.5 mm headphone jack, 4x onboard digital microphones, I2S via HDMI

Operating Systems

Android and Linux

Target Applications

AI cameras, video conferencing, robotics, edge AI gateways

Overview

The Thundercomm TurboX C7790 development kit is a compact edge AI evaluation and prototyping platform built around the Qualcomm Dragonwing Q-7790 (CQ7790S) 4 nm processor. It delivers up to 24 TOPS of INT8 AI performance through the NSP3 neural processor with 8K HMX and four HVX vector engines, backed by an octa-core Kryo CPU running to 2.8 GHz and an Adreno 722 GPU.

The kit combines a TurboX C7790 system-on-module with 12 GB of LPDDR5X and 128 GB of flash storage and a carrier board that exposes a broad interface set: dual Gigabit Ethernet, three 4-lane D-PHY camera connectors with a triple ISP supporting 21MP + 21MP + 21MP, DisplayPort over USB Type-C, MIPI DSI, HDMI and four USB 3.0 ports. M.2 M-Key and E-Key sockets add NVMe storage and Wi-Fi/Bluetooth.

Target applications include AI cameras, video conferencing systems, robotics and edge AI gateways, with both Android and Linux supported. A low-power audio DSP (LPASS) with an embedded eNPU5 keeps always-on audio processing available without waking the main CPU. QS Compute supplies and quotes the Thundercomm TurboX C7790 development kit worldwide.

Key Benefits

['24 TOPS INT8 NPU for vision and generative edge AI workloads', '12 GB LPDDR5X and 128 GB flash populated on the SoM', 'Triple ISP with 21MP + 21MP + 21MP camera support', 'Dual Gigabit Ethernet plus M.2 expansion for storage and wireless', 'Android and Linux support with always-on audio DSP']

Applications

['Smart AI cameras and video analytics appliances', 'Video conferencing and collaboration devices', 'Robotics and autonomous platforms', 'Edge AI gateways and industrial IoT nodes', 'Retail analytics and smart building products']

Request a Quote — THUNDERCOMM TURBOX C7790 — QUALCOMM DRAGONWING Q-7790 EDGE AI DEVELOPMENT KIT

QS Compute — global B2B supply of AI computing hardware, edge AI systems and accelerators. Volume pricing, 15-day sample lead time.

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