43×44mm LGA system-on-module · 6nm octa-core · up to 10 TOPS NPU · 8GB/4GB LPDDR5 · 64GB UFS 3.1 · GbE + Wi-Fi 6/6E · -35~75°C
Up to 10 TOPS
MediaTek 8th-gen NPU (NPU850)
2× Cortex-A78 @ 2.6GHz
+ 6× Cortex-A55 @ 2.0GHz
2× Cortex-A78 @ 2.2GHz
+ 6× Cortex-A55 @ 2.0GHz
Arm Mali-G57 MC2
@ 1.1GHz / 880 MHz
6nm
8GB LPDDR5 (720G)
4GB LPDDR5 (520G)
64GB UFS 3.1
SD card interface
Gigabit Ethernet
opt. Wi-Fi 6/6E + BT 5.x
4-lane MIPI DSI · eDP · DP
LVDS (muxed with DSI)
2× ISP (720G) / 1× ISP (520G)
4-lane MIPI CSI
Decode / encode
up to 1920×1200 @ 60fps
3× USB 3.2 · 3× USB 2.0
PCIe Gen2 x1 · 4× UART
I2C · SPI · GPIO · SDIO · ADC
43 × 44 × 2.95 mm
LGA SoM
-35°C to +75°C
<4W (AI workload)
3.7V nominal input
NDAA · TCA
Available
Quote
The Lantronix Open-M 720G and 520G are ultra-compact 43 × 44 mm LGA system-on-modules built on MediaTek's Genio 720 (MT8391) and Genio 520 (MT8371) 6nm SoCs. Both deliver up to 10 TOPS of AI performance via MediaTek's 8th-generation NPU, an octa-core Arm CPU (two Cortex-A78 + six Cortex-A55), and an Arm Mali-G57 MC2 GPU — enabling efficient, low-power execution of Vision AI and GenAI tasks at the edge. The 720G is the higher-clocked sibling (2.6 GHz vs 2.2 GHz, 8GB vs 4GB LPDDR5, dual vs single ISP), while the two modules remain software- and design-compatible for scalable product families.
Targeting drones, robotics, smart cameras, and industrial IoT, the Open-M series pairs LPDDR5 memory with 64GB UFS 3.1 storage, Gigabit Ethernet, optional Wi-Fi 6/6E and Bluetooth, triple display output (MIPI DSI / eDP / DP / LVDS), and rich peripheral I/O (4× UART, I2C, SPI, GPIO, SDIO, ADC, I2S/PCM). The module draws under 4W under AI workload and carries a -35°C to +75°C operating range with NDAA and TCA compliance for defense and government deployments. Lantronix debuts the platform publicly at Commercial UAV Expo (Sept 1–3, 2026).
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