AAEON's first SMARC module with Qualcomm Dragonwing QCS6490 — 82×50mm MXM 3.0 SoM for robotics, healthcare, industrial automation and digital signage.
Qualcomm Dragonwing
QCS6490 (6nm)
Octa-core Kryo 670
1× A78 Gold+ @2.7GHz
3× A78 Gold @2.4GHz
4× A55 Silver @1.9GHz
Adreno 643 @812MHz
OpenGL ES 3.2
OpenCL 2.0 + VPU
Hexagon NPU
On-device AI inference
Video encode/decode
SMARC 2.1 compliant
82 × 50 mm
314-pin MXM 3.0
Up to 16GB LPDDR5
Up to 64GB UFS
SDIO 3.0 (SD card)
DisplayPort 1.4
Up to 2K @ 60Hz
Dual GbE
1× USB 3.1
4× USB 2.0 (hub)
1× PCIe 3.0 x1
2× SPI, 3× I2C
14-bit GPIO (1 PWM)
2× UART 4-wire (1.8V)
2× UART 2-wire (1.8V)
1× I2S
LiDAR, IMU, cameras
Robotic controllers
Smart displays
The AAEON uCOM-Q6490 is AAEON's first SMARC 2.1 System-on-Module built on Qualcomm technology, pairing the Qualcomm Dragonwing QCS6490 octa-core SoC with a compact 82 × 50 mm module that plugs into any standard MXM 3.0 edge connector. It targets robotics, portable healthcare imaging, industrial automation and digital signage where a small, lightweight, fanless compute node must handle on-device AI inference alongside rich I/O.
The Kryo 670 CPU combines a single Cortex-A78 Gold Plus core at 2.7 GHz, three Cortex-A78 Gold cores at 2.4 GHz and four Cortex-A55 Silver cores at up to 1.9 GHz, balanced for both burst performance and sustained efficiency. The Adreno 643 GPU and integrated VPU provide multi-format video encode/decode for signage and imaging workloads, while the Hexagon NPU accelerates on-device AI across vision and sensor fusion.
QS Compute supplies the uCOM-Q6490 with up to 16GB LPDDR5 and 64GB UFS, and can pair it with carrier boards and BSP bring-up support for OEM integration.
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