Specifications
Standard
Open Compute Project Open Rack v3 (ORv3) base specification
Model
Sanmina Open Rack (ORv3)
Dimensions
2,286 mm H x 600 mm W x 1,068 mm D (90 x 23.62 x 42.05 inch)
Load Rating
1,400 kg (3,080 lbs) with heavy-duty casters
Mounting Standards
21 inch OU mounting, plus 19 inch RU mounting with an optional accessory
Equipment Capacity
44 Open U and 47 RU of usable equipment space
DC Busbar
ORv3 48 V DC busbar delivering up to 18 kW per rack
Power Delivery
Busbar system avoids unreliable power-cord connections
Liquid Cooling
Mounting provisions for liquid cooling manifolds — cold-plate ready at 30 kW per rack
Cable Management
Built-in cable management with top and bottom cable pass-through
Compatibility
Compatible with all Open Rack IT systems
Assembly
Tool-free rack connection and tool-free equipment mounting
Accessories
Door kit, modular side panels kit, OCP-aligned busbar, IT gear rails
Customisation
Optional side panels and doors; adaptable to customer application under OCP compliance
Manufacturing
Sanmina enclosure manufacturing with global integration and system assembly
Target Applications
AI factory and hyperscale deployments, ORv3 power shelves, cold-plate GPU racks
Overview
The Sanmina Open Rack v3 is the mechanical and power-distribution foundation of an Open Compute Project compliant AI rack. At 2,286 mm tall, 600 mm wide and 1,068 mm deep, it is rated to carry 1,400 kg on heavy-duty casters and accepts both 21 inch Open U and 19 inch RU equipment — an important detail because ORv3 power shelves use the 21 inch OU grid while legacy IT gear still mounts on 19 inch rails. Forty-four OU or forty-seven RU of space are available depending on the mounting standard used.
Power is distributed over an ORv3 48 V DC busbar rated to 18 kW per rack. Using a busbar instead of discrete power cords removes the most common mechanical failure point in high-density rows and makes shelf swaps a plug-in operation. That 48 V DC architecture is what ORv3 power shelves, including the 18 kW and 33 kW class units used in AI racks, are designed to feed.
For AI density the rack includes mounting provisions for liquid cooling manifolds and supports cold-plate deployments at 30 kW per rack, with built-in cable management and top and bottom pass-through for coolant and network routing. The rack ships as an OCP-compliant platform with door and side-panel kits, IT gear rails and cabling accessories available separately, and assembly is tool-free for both rack joining and equipment mounting.
Key Benefits
OCP ORv3 compliant: matches the specification that AI power shelves, busbars and IT gear are designed against. 18 kW 48 V DC busbar: higher reliability and simpler maintenance than corded power distribution. Cold-plate ready: manifold mounting provisions support 30 kW per rack liquid-cooled deployments. Dual mounting grid: 21 inch OU and 19 inch RU support lets one rack carry both ORv3 infrastructure and legacy servers. Global enclosure manufacturing: integration and final system assembly available from the same supplier.
Applications
AI factory and hyperscale data centre deployments, Open Compute Project rack-scale builds, ORv3 48 V DC power shelf installations, cold-plate liquid-cooled GPU racks, and colocation or greenfield halls being fitted to OCP standards.
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