Specifications
Sensor
Sony IMX927
Interface
CoaXPress over fibre (CXP-over-Fibre)
Data rate
up to 100 Gbit/s
Target application
Advanced semiconductor inspection
Key requirement
Sustained bandwidth with thermal stability
Camera family
Teledyne Vision Solutions (DALSA / e2v)
Shown at
VISION 2026 Stuttgart — booth 8B10, Hall 8
Link type
Optical CXP (≈100 m cable runs)
Ecosystem
GenICam / GigE Vision-class software stack
Cooling
Engineered for sustained thermal load
Use cases
Wafer and photomask inspection, high-throughput AOI
Vendor
Teledyne Vision Solutions (global)
Overview
Teledyne Vision Solutions presented a high-throughput semiconductor-inspection imaging platform built on the Sony IMX927 sensor with a CoaXPress-over-Fibre interface delivering data rates up to 100 Gbit/s. It targets advanced semiconductor inspection, where sustained bandwidth and thermal stability are critical.
CoaXPress-over-Fibre carries the sensor's throughput over long optical links without repeaters, letting inspection tools place the camera far from the host while maintaining full rate.
Key Benefits
100 Gbit/s over a single optical link, Sony IMX927 sensor performance, and extended cable reach for large semiconductor-inspection gantries.
Applications
Semiconductor wafer and photomask inspection, high-throughput automated optical inspection (AOI), flat-panel inspection, and long-reach multi-camera vision systems.
Request a Quote — TELEDYNE VISION SOLUTIONS — 100 GBIT/S COAXPRESS-OVER-FIBER IMX927 PLATFORM
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