Specifications
Model
STSafeSense VD56GA
Resolution
1.1 MP, delivering 2.7 MP-equivalent in-cabin performance
Target Application
Infrared driver monitoring (DMS) and occupant monitoring (OMS)
Pixel Technology
ST DeepNIR backside-illuminated architecture optimised for near-infrared
MTF Sharpness
35% higher modulation transfer function than the previous generation
IR Quantum Efficiency
Nearly 60% higher than the previous generation
Package
3.7 x 3.2 mm chip-scale package (CSP)
Embedded ISP
Mirror, crop, dark calibration, auto exposure and piecewise-linear processing
Output Formats
RAW and YUV
External Processing
None required — integrated functions remove the need for an external ISP
Optics Impact
Enables lower-cost lenses and less demanding optical filtering
Illumination Impact
Higher IR sensitivity reduces infrared illumination requirements
Integration
Suits space-constrained in-cabin camera modules, including under-display cameras
Family
ST SafeSense automotive image sensor family — over 10 million units shipped
Manufacturing
Front-end fabricated at ST's Crolles facility in France
Availability
Samples available now via ST sales offices
Announced
September 14, 2026
Primary Market
OEMs and Tier 1 suppliers scaling DMS/OMS across high-volume vehicle lines
Overview
The ST SafeSense VD56GA is a 1.1 MP automotive image sensor built specifically for infrared in-cabin sensing — driver monitoring and occupant monitoring. ST's claim is a system-level one: the sensor extracts 2.7 MP-equivalent in-cabin image quality from a 1.1 MP architecture, which lets Tier 1 suppliers specify cheaper optics and less demanding optical filtering into the camera module.
Underneath is a new backside-illuminated pixel architecture called ST DeepNIR, optimised for near-infrared. Compared with the previous generation it delivers 35% higher modulation transfer function sharpness and nearly 60% higher infrared quantum efficiency — the combination that ST says is unique in this class and that makes challenging placements such as under-display cameras practical.
Equally important for cost, image processing is integrated. Mirror, crop, dark calibration, auto exposure and piecewise-linear processing all run on-chip, with RAW and YUV outputs offered so camera developers can fit the sensor to different electronic architectures. That removes the external ISP from the bill of materials. The device sits in a 3.7 x 3.2 mm CSP, belongs to the SafeSense family that has shipped over 10 million automotive sensors, and is front-end manufactured at ST's Crolles fab in France.
Key Benefits
2.7 MP-equivalent performance from a 1.1 MP sensor lowers module cost without compromising DMS/OMS image quality. Integrated ISP functions eliminate an external processor from the camera design. DeepNIR sensitivity reduces IR illumination and optical filtering requirements, shortening overall system cost and power.
Applications
Driver monitoring systems (DMS), occupant monitoring systems (OMS), in-cabin fatigue and distraction detection, under-display camera modules, and cost-sensitive high-volume automotive vision platforms.
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