LooperRobotics Insight 9 — Standalone Spatial AI Camera on D-Robotics RDK X5

Specifications

Overview

The LooperRobotics Insight 9 is a standalone spatial AI camera: the compute, the AI accelerator, the RGB sensor, the stereo depth pair and the IMU all sit inside a 129 × 33.8 × 35 mm aluminium body, and the whole thing runs off a single USB 3.0 Type-C cable that also powers it. There is no host GPU and no separate depth-processing board.

Its perception stack, which LooperRobotics calls a Tri-Eye Perception Matrix, pairs an 8.4 MP Sony Starvis IMX415 RGB sensor with a 188° diagonal field of view against two SmartSens SG0132 global-shutter sensors in a stereo pair. Global shutter matters for the depth channel specifically: it removes rolling-shutter skew between the stereo pair on fast-moving platforms, which is exactly the failure mode that degrades depth on a walking quadruped or a moving mobile base. Depth covers 0.1 m to 30 m, with an engineering sweet spot of 0.2 m to 8.0 m.

The compute is a D-Robotics RDK X5: eight Cortex-A55 cores at 1.5 GHz, a 32 GFLOPS GPU and a 10 TOPS BPU 3.0, backed by 4 GB of LPDDR4 and 16 GB of eMMC 5.1. A Bosch BMI088 6-axis industrial IMU provides motion sensing with under 10 µs of synchronisation accuracy and a ±2000 °/s gyro range. Typical power draw is 5 W and the enclosure is rated from −20 °C to +85 °C, with ROS 2 support for embodied-intelligence and robotics stacks.

Key Benefits

Depth without host compute. Stereo depth, RGB and 10 TOPS of AI inference are all processed inside the camera — the host only takes the results over USB 3.0. Global-shutter stereo. Two SmartSens SG0132 sensors remove rolling-shutter skew between the depth pair on fast-moving platforms. 188° RGB field of view. A single camera covers the wide forward arc that would otherwise need two or three. 5 W and −20 to +85 °C. Low enough power for a battery-carrying robot and a wide enough temperature range for an industrial or outdoor enclosure.

Applications

Autonomous mobile robots and quadrupeds, embodied-intelligence and physical-AI research, AGV and AMR navigation, warehouse and logistics picking, drone and UAV perception, collaborative-robot safety envelopes, 3D scanning and mapping, ROS 2 development platforms.

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