Specifications
Product
ASRock Industrial NVIDIA Jetson AGX Orin Developer Kit
Form Factor
Developer carrier board
Supported SOMs
NVIDIA Jetson AGX Orin Series — Industrial, 64 GB and 32 GB modules
AI Performance
Up to 275 TOPS INT8 (AGX Orin 64 GB); 248 TOPS INT8 (Industrial module); 200 TOPS INT8 (32 GB module)
GPU
NVIDIA Ampere architecture GPU integrated in the Jetson AGX Orin SOM
Memory
32 GB or 64 GB LPDDR5 depending on the fitted SOM
Camera Interfaces
Supports up to four 4-lane MIPI or GMSL II cameras for computer vision
PoE
12 PoE ports for networked cameras and sensors
High-Speed Expansion
2x PCIe Gen4 x8 slots
M.2 Expansion
1x M.2 Key M (PCIe Gen4 x4), 1x M.2 Key B for 4G/5G with SIM, 1x M.2 Key E for Wi-Fi/Bluetooth
Storage
MicroSD slot plus M.2 Key M NVMe storage
Headers
40-pin expansion header
Dimensions
190.32 mm (W) x 210.31 mm (D)
Operating Humidity
5% to 85% RH
Storage Temperature
-25 °C to 80 °C
Storage Humidity
30% to 70% RH
Indicators
1x storage LED and 1x user-defined LED
Controls
Power-on button with LED, OS flash button, reset tact switch and an enable/disable auto power-on jumper
Target Applications
Edge AI, robotics and advanced industrial applications requiring supercomputer-class inference
Overview
The ASRock Industrial Jetson AGX Orin Developer Kit is an industrial-grade carrier board for NVIDIA's Jetson AGX Orin family, accepting the AGX Orin Industrial, 64 GB and 32 GB system-on-modules. Depending on the fitted SOM it delivers 200, 248 or up to 275 TOPS of INT8 AI performance on the Ampere GPU, with either 32 GB or 64 GB of LPDDR5 memory, positioning it for robotics and demanding industrial inference workloads.
The board is built around computer vision: it supports up to four 4-lane MIPI or GMSL II cameras and provides twelve PoE ports for networked cameras and sensors, alongside two PCIe Gen4 x8 slots and M.2 Key M, Key B and Key E sockets for NVMe storage, 4G/5G cellular and Wi-Fi/Bluetooth. A 40-pin expansion header, OS flash button, reset switch and auto power-on jumper round out the developer platform, which measures roughly 190 x 210 mm and tolerates storage temperatures from -25 °C to 80 °C.
Key Benefits
SOM flexibility: one carrier board for AGX Orin Industrial, 64 GB and 32 GB modules. Up to 275 TOPS of Ampere-class edge inference. Vision-ready I/O: four 4-lane MIPI or GMSL II camera inputs plus 12 PoE ports. Dual PCIe Gen4 x8 and three M.2 sockets for storage and connectivity. Industrial thermal envelope with an extended storage temperature range and auto power-on control.
Applications
Multi-camera machine vision and inspection systems, autonomous mobile robots and AMRs, smart-factory and industrial automation, video analytics and intelligent surveillance, medical imaging evaluation, and Jetson AGX Orin prototyping that must transition to an industrial deployment.
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