Specifications
Flagship PIC
NPG10204 DR8 — NewPhotonics first 1.6T DR8 PIC
Architecture
Octal channel, 224 Gbps per lane
Line Rate
200G-per-lane PAM4 across 8 channels (1.6 Tbps)
Modulator
Electro-absorption modulators (EAM)
Lasers
Integrated lasers — no external laser source required
Signal Processing
OSPic optical signal-processing engine
Earlier PIC
NPG102 LPO+ transmitter-on-chip (800G LPO)
3.2T Product
Industry-first 3.2 Tbps optical chip (March 2026)
Module, 1.6T
AiPhoton 1.6T OSFP transceiver (with Gemtek)
Module, 800G
Gemtek OMDN-107 800G LPO transceiver
Validation
With NVIDIA, Amazon and Microsoft (H2 2026)
Mass Production
Targeted 2027
Target
GPU and AI server optical interconnect
Application Fit
Pluggable modules and Co-Packaged Optics (CPO/NPO)
Founder
Israeli optical communications startup, founded 2020
Benefit
Fewer components, smaller footprint, simpler assembly
Partners
Gemtek (high-volume manufacturing)
Overview
NewPhotonics designs highly integrated silicon photonics transmitter-on-chip (TOC) PICs for AI datacenter optical interconnect. Its NPG10204 DR8 is a 1.6T DR8 PIC with integrated lasers and octal-channel 224 Gbps-per-lane signalling, delivering 200G-per-lane PAM4 across eight channels for 1.6 Tbps optical connectivity.
The NPG10204 integrates electro-absorption modulators (EAM) and the OSPic optical signal-processing engine on the photonic chip, eliminating the need for external laser sources, reducing chip footprint and simplifying module assembly. It is the PIC behind the AiPhoton 1.6T OSFP transceiver, produced in partnership with Gemtek. NewPhotonics also unveiled an industry-first 3.2 Tbps optical chip in March 2026. The technology is under product validation with NVIDIA, Amazon and Microsoft, with mass production targeted for 2027, and targets both pluggable modules and co-packaged optics.
Key Benefits
Integrated lasers and EAM modulators remove external laser sources, cut component count and shrink the PIC footprint. 224Gbps per lane, 8-channel PAM4 delivers 1.6T with DSP functionality for scale-out. On-chip signal processing (OSPic) addresses electrical impairments in the photonic chip, and the roadmap reaches 3.2T.
Applications
1.6T DR8 pluggable transceivers, 800G LPO modules, GPU and AI server optical interconnect, co-packaged and near-packaged optics (CPO/NPO), and hyperscale AI cluster fabrics.
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