Specifications
1.6T Transceiver
1.6T DR4 OSFP pluggable prototype — 4x400 Gbps over single-mode fiber
Laser Content
Four Lumentum 400G differential EML lasers
Host Interface
8x200 Gbps electrical interface
Roadmap
Stepping-stone to a future 3.2T module
SHP Laser
1310 nm high-power laser: >1.0 W at 25C, >800 mW at 50C
SHP Linewidth
<100 kHz linewidth, >40 dB SMSR
SHP Use
Co-packaged optics (CPO) light source; direct-detect and coherent-lite
DWDM Source
16-channel DWDM laser source via two ELSFP modules
DWDM Grid
200 GHz grid centered at 1310 nm; ~24 dBm per channel
MSA Compliance
CW-WDM MSA
C-OCM
Coherent Optical Channel Monitor — 2x C-band + 2x L-band channels, 4x density, concurrent scan
iTLA
C+L band integrated tunable laser; >200% wider tuning, 12.4 THz continuous coverage
WSS
Quad integrated C+L band 3x33 WSS module
DGE
Multi-rail DGE with integrated OCMs — 8 equalizers + 16 channel monitors
Event
OFC 2026, Los Angeles (booth 1439)
Vendor
Lumentum Holdings (NASDAQ: LITE), San Jose, California
Overview
Lumentum supplies lasers, modules and optical subsystems across the three axes that define AI networking: scale-out (between compute nodes), scale-up (within a pod) and scale-across (between data centers). At OFC 2026 the company demonstrated a 1.6T DR4 OSFP pluggable transceiver prototype built from four 400G differential EML lasers, with an 8x200 Gbps host interface as a stepping-stone to a future 3.2T module.
For co-packaged optics the SHP laser delivers more than 1.0 W optical power at 1310 nm with sub-100 kHz linewidth, and a 16-channel DWDM external laser source built from two ELSFP modules provides ~24 dBm per channel on a CW-WDM MSA-compliant 200 GHz grid. Coherent monitoring and C+L band tuning products complete the portfolio for scale-across DCI.
Key Benefits
Single-vendor coverage from pluggable optics to CPO light sources. High-power SHP laser enables silicon photonics and CPO architectures. CW-WDM MSA-compliant DWDM sources reduce fiber count. Instrument-grade coherent monitoring for multi-rail DCI.
Applications
AI scale-out and scale-up optical fabric, co-packaged optics external light sources, hyperscale DCI, and next-generation 3.2T optical modules.
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