Specifications
Product
Cadence 224G Long-Reach (224G-LR) SerDes PHY IP
Process
TSMC N3E (3nm)
Data Rate
1 Gbps to 225 Gbps across LR, MR and VSR reaches
Architecture
ADC / DSP-based SerDes (112G heritage)
Modulation
PAM4 at VSR and MR
Silicon Status
First-pass silicon success
Channel Loss
~40 dB for copper cable (CR) and backplane (KR); 25-35 dB for C2M/C2C
Target Networks
800G and 1.6T hyperscale datacenter and AI infrastructure
Sibling IP
112G LR SerDes PHY IP (field-proven)
PCIe IP
PCIe 6.0 / 5.0 / 4.0 / 3.0 / 2.0
Multi-Protocol SerDes
64G / 32G multi-protocol SerDes
UCIe IP
Up to 32 Gbps, half-rate and quad-rate, internal PLL, 100 MHz ref clock
UCIe Reliability
Maintenance-mode runtime recalibration across -40 to 125°C
Memory IP
LPDDR5x/5/4x/4, DDR5/4/3 and GDDR7/6
Target SoCs
AI accelerators, hyperscale switch and NIC silicon, chiplets
Overview
Cadence's 224G Long-Reach (224G-LR) SerDes PHY IP extends the company's DSP-based SerDes line to 224G per lane, built on an ADC/DSP architecture and taped out on TSMC's N3E process with first-pass silicon success.
The IP supports data rates from 1 Gbps to 225 Gbps across long-reach, medium-reach and very-short-reach channels, targeting the 800G and 1.6T networks used in hyperscale data centers and AI infrastructure. Its ADC/DSP front end is designed to handle the roughly 40 dB channel loss typical of copper cable and backplane links.
It sits within a broader Cadence high-speed IP portfolio on N3E that also includes 112G LR SerDes PHY, PCIe 6.0, 64G/32G multi-protocol SerDes, UCIe die-to-die IP and DDR5/GDDR7 memory IP — the full interface set for large AI and hyperscale SoCs and chiplets.
Key Benefits
224G per lane halves the lane count for 800G and 1.6T links; ADC/DSP architecture handles high channel loss on standard PCB; first-pass silicon success de-risks integration; full companion IP set (PCIe 6.0, UCIe, DDR5, GDDR7) enables single-vendor high-speed interfaces.
Applications
AI accelerator and XPU SoCs, hyperscale Ethernet switch and NIC silicon, chiplet/die-to-die interconnect, 800G/1.6T optical and copper module controllers, and HPC networking ASICs.
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