Specifications
Models
SOM-V2N-OSM (RZ/V2N), SOM-V2H-OSM (RZ/V2H), SOM-V2L-OSM (RZ/V2L)
Standard
SGeT Open Standard Module (OSM) specification v1.2
Form Factor — V2N
OSM Size-M, 45 x 35 mm
Form Factor — V2H / V2L
OSM Size-L, 45 x 45 mm
CPU — V2N
Quad-core Arm Cortex-A55 @ 1.8 GHz
CPU — V2H
4x Arm Cortex-A55 @ 1.8 GHz plus 2x Cortex-R8 real-time cores @ 800 MHz and a Cortex-M33 @ 200 MHz for system management
NPU — V2N
DRP-AI3 delivering up to 4 dense TOPS / 15 sparse TOPS
NPU — V2H
DRP-AI3 delivering up to 8 TOPS INT8 or 80 TOPS sparse
GPU
Arm Mali-G31 3D graphics engine (GE3D) — OpenGL ES 3.2, OpenCL 2.0 FP
H.264
Up to 1920 x 1080 @ 60 fps
H.265
Up to 3840 x 2160 @ 30 fps
Memory — V2N
8 GB LPDDR4X
Memory — V2H
16 GB LPDDR4X (2x 8 GB)
Cameras
2x 4-lane MIPI CSI-2
Networking
2x Gigabit Ethernet (RGMII)
USB
1x USB OTG, 1x USB 2.0, 1x USB 3.0
Serial
5x UART (1x console) and 1x SPI
Operating Temperature
-20 °C to +85 °C
Humidity
5 % to 95 % RH, non-condensing
Positioning
Compact size, low power consumption and on-module AI capability for embedded systems
Overview
Geniatech introduced three OSM system-on-modules on the Renesas RZ/V2N, RZ/V2H and RZ/V2L microprocessors, all built to the SGeT Open Standard Module specification version 1.2. The RZ/V2N part, SOM-V2N-OSM, occupies OSM Size-M at 45 x 35 mm, while the SOM-V2H-OSM and SOM-V2L-OSM occupy OSM Size-L at 45 x 45 mm. Geniatech's stated targets are embedded systems that need compact size, low power consumption and on-module AI.
The SOM-V2N-OSM combines a quad-core Cortex-A55 cluster at 1.8 GHz with a DRP-AI3 accelerator rated up to 4 dense or 15 sparse TOPS, 8 GB of LPDDR4X, two 4-lane MIPI CSI-2 camera interfaces, dual Gigabit Ethernet on RGMII, USB OTG and USB 2.0/3.0, and five UARTs. It is the first OSM module based on the Renesas RZ/V2N that has been publicly covered, and Geniatech positions it against SoM alternatives such as the SOMDEVICES microSMARC RZ/V2N module.
The SOM-V2H-OSM steps up to a four-core Cortex-A55 cluster plus two Cortex-R8 real-time cores at 800 MHz and a Cortex-M33 at 200 MHz for system management, with the DRP-AI3 block rising to 8 TOPS INT8 or 80 TOPS sparse and memory doubling to 16 GB of LPDDR4X across two 8 GB packages. All three parts share the Mali-G31 GPU, the same H.264 and H.265 video capability, and a -20 to +85 °C operating range with 5 to 95 percent non-condensing humidity — the industrial envelope that makes an OSM module usable without a custom thermal design.
Key Benefits
SGeT OSM standardisation means one carrier can accept OSM Size-M and Size-L modules from this and other vendors. DRP-AI3 to 15 sparse TOPS on the V2N and 80 sparse TOPS on the V2H scales edge inference without changing the baseboard. Two 4-lane MIPI CSI-2 interfaces and dual RGMII Gigabit Ethernet cover stereo or dual-camera vision pipelines. -20 to +85 °C operation with 45 x 35 mm / 45 x 45 mm footprints keeps the module suitable for sealed industrial enclosures.
Applications
Embedded vision and industrial cameras, robotics and machine-vision front-ends, smart-retail and access-control endpoint hardware, industrial HMI with local inference, edge AI gateways requiring an OSM-compliant module.
Request a Quote — GENIATECH RZ/V2N / V2H / V2L OSM MODULES — SGET OSM SIZE-M AND SIZE-L
QS Compute — global B2B supply of AI computing hardware, edge AI systems and accelerators. Volume pricing, 15-day sample lead time.
Get Your Quote →