Specifications
Products
Boardcon CM311Y3 system-on-module and Idea311Y3 development board
SoC
Amlogic A311Y3
CPU
2x Arm Cortex-A78 @ up to 2.4 GHz plus 6x Arm Cortex-A55 @ up to 2.0 GHz, with an additional RISC-V core for system control and power management
GPU
Arm Mali-G625 MC1
NPU
8 TOPS supporting INT4, INT8, INT16, FP8, FP16 and BF16 workloads
ISP
16 MP image signal processor
Video
Decode up to 4K @ 120 fps; H.264/H.265 encode up to 4K @ 60 fps; MJPEG encode up to 4K @ 30 fps
Display Interfaces
HDMI 2.1a, eDP, MIPI-DSI, LVDS and V-by-One depending on interface configuration
Module Memory
4 GB / 8 GB / 16 GB LPDDR5 or LPDDR5X
Module Storage
32 GB / 64 GB / 128 GB / 256 GB eMMC, plus FSPI flash support
Module Form Factor
52 × 45 mm, 210-pin 0.9 mm-pitch QFN; 3.4 V to 5.5 V supply range
High-Speed Module I/O
PCIe 3.0 x2 (or two PCIe 3.0 x1 links), a multiplexed USB 3.0 / PCIe 2.0 x1 / HSGMII interface, USB 2.0, SDIO 3.0, SD 3.0, CAN FD, SPI, UART, I2C, I3C, PWM and ADC
Ethernet PHY
RGMII and HSGMII with onboard Realtek RTL8211F PHY
Camera Interfaces
Two 4-lane MIPI-CSI, or two 2-lane plus an additional 4-lane interface for up to three cameras
Carrier Storage
microSD slot plus M.2 M-Key socket for PCIe 3.0 NVMe SSDs
Carrier Networking
2x 10/100/1000 Mbps Ethernet; AP6256 Wi-Fi 802.11ac/a/b/g/n + Bluetooth 5.4; Mini PCIe socket and Nano-SIM slot for cellular (optional Quectel EC20 LTE)
Carrier Video I/O
HDMI 2.1a input and HDMI 2.1 output, both up to 3840 × 2160 @ 60 Hz; 2x 4-lane MIPI-CSI; optional Sony IMX415 8.46 MP and IMX307 2.13 MP cameras
Carrier Serial I/O
12-pin pluggable terminal block carrying RS-232, RS-485, CAN and speaker connections, plus a 3-pin debug UART
Carrier Power & Size
12V/3A DC input; carrier board 155 × 115 mm
Software
Android 16 with U-Boot 2025.01, Linux kernel 6.12.69 and an Ubuntu 22.04 cross-compilation environment
Overview
Boardcon's CM311Y3 is a 52 × 45 mm system-on-module built on the Amlogic A311Y3 processor. The SoC pairs two Arm Cortex-A78 cores at up to 2.4 GHz with six Cortex-A55 cores at up to 2.0 GHz, adds a RISC-V core for system control and power management, and integrates a Mali-G625 MC1 GPU with an NPU rated at 8 TOPS across INT4, INT8, INT16, FP8, FP16 and BF16 precisions. A 16 MP ISP and 4K120 decode capability suit it to camera-centric designs.
The module carries up to 16 GB of LPDDR5/LPDDR5X and up to 256 GB of eMMC, exposes PCIe 3.0 x2 and a multiplexed USB 3.0 / PCIe 2.0 / HSGMII interface, and supports up to three MIPI-CSI cameras. It mates to the Idea311Y3 carrier board (155 × 115 mm), which adds dual Gigabit Ethernet, HDMI 2.1 input and output at 4K60, M.2 NVMe storage, Wi-Fi and Bluetooth 5.4, an optional LTE modem, and an industrial terminal block carrying RS-232, RS-485 and CAN. Boardcon lists Android 16 with U-Boot 2025.01 and Linux kernel 6.12.69; pricing and availability are not yet published.
Key Benefits
8-TOPS NPU with INT4 through BF16 precision support. Six-core A78/A55 CPU plus RISC-V co-processor for control and power management. Up to 16 GB LPDDR5X and 256 GB eMMC on a 52 × 45 mm module. HDMI 2.1 input and output at 4K60 for vision and signage. Industrial carrier I/O: RS-232, RS-485, CAN, dual GbE and PCIe 3.0 NVMe.
Applications
Machine-vision and video-analytics appliances, industrial HMI and signage with HDMI capture, robotics and automation controllers, IoT gateways with cellular backhaul, medical and laboratory imaging, and embedded designs needing an upgradable SoM plus carrier strategy.
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