Specifications
Form Factor
3.5-inch SBC, 146 × 102 mm
SoC Options
Intel Core 7 350 / Core 5 320 / Core 3 305 (Wildcat Lake)
CPU Configuration
6 cores — 2 P-cores + 4 LPE-cores, 15 W TDP
CPU Frequency
1.5 GHz base to 4.8 GHz (Core 7 350)
Integrated Graphics
16 EU (Core 3 305) to 32 EU Intel Graphics, up to 2.6 GHz
System Memory
Up to 64 GB DDR5-6400
Storage
2× M.2 M-Key 2280 (PCIe x2) NVMe SSD sockets
Ethernet
1× 2.5GbE Intel i226 with TSN, 1× 1GbE Intel i210 with OOB
USB
1× USB4 Type-C, 1× USB 3.2 Type-C (100 W PD), 2× USB 3.2 Type-A, 2× USB 2.0
Serial / Fieldbus
2× RS-232/422/485, 1× CAN FD
Display Outputs
HDMI 2.1, DisplayPort 2.1 via USB-C, DisplayPort 1.4a via USB-C, LVDS (12 V/5 V)
Simultaneous Displays
Up to 3 (HDMI + USB Type-C + LVDS)
Expansion
MIOe interface (MIOe-TCPD 100 W USB-C PD, MIOe-UMXM external dGPU)
Audio
Realtek ALC888S codec, Line-in / Line-out / MIC
Security
Integrated TPM 2.0
Power Input
12–24 V DC (4-pin ATX) or USB PD up to 100 W
Operating Temperature
0 °C to 60 °C
Vibration
3.5 Grms
Certifications
CE, FCC Class B
OS Support
Windows 11 IoT Enterprise LTSC 2024, Ubuntu Desktop 24.04 LTS
Overview
The Advantech MIO-5356 is the first industrial 3.5-inch single board computer built on Intel Core Series 3 “Wildcat Lake” silicon. It is a fanless MI/O-Compact board that keeps the classic 146 × 102 mm footprint while moving to a 6-core (2 performance + 4 low-power-efficient) CPU at a 15 W TDP, so it drops into existing 3.5″ enclosures without a thermal redesign.
Three CPU SKUs cover the range: Core 3 305 with 16 execution units of integrated graphics, and Core 5 320 / Core 7 350 with 32 EU and clocks to 4.6 / 4.8 GHz. All three carry the same 15 W base power, which makes the board suitable for sealed, passively cooled enclosures in kiosk, medical and factory-floor applications.
Connectivity is unusually complete for the form factor: USB4, a 2.5GbE port with TSN support for time-sensitive industrial networking, a second Gigabit port with out-of-band management, CAN FD for vehicle and machine buses, and dual NVMe sockets. The MIOe expansion connector accepts Advantech's PD and external-GPU mezzanines, so the same baseboard can be re-used across several product tiers.
Key Benefits
First-to-market Wildcat Lake 3.5″ SBC — the newest Intel Core Series 3 platform in a standard MI/O-Compact footprint. 15 W fanless envelope keeps enclosure design simple. USB4 + 2.5GbE TSN + CAN FD cover high-speed host I/O, time-sensitive networking and fieldbus in one board. Dual NVMe + MIOe mezzanine allow local AI storage and functional expansion without a new product. Available through QS Compute with volume pricing and 15-day sample lead time.
Applications
Industrial edge controllers, machine-vision front ends, kiosk and medical panels, transportation gateways and factory automation nodes where a 3.5″ board must host a modern Intel Core Series 3 CPU, dual NVMe storage and TSN-capable networking inside a fanless enclosure.
Request a Quote — ADVANTECH MIO-5356 — 3.5″ SBC ON INTEL CORE SERIES 3 “WILDCAT LAKE”
QS Compute — global B2B supply of AI computing hardware, edge AI systems and accelerators. Volume pricing, 15-day sample lead time.
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