Specifications
Model
TYAN B8261T85E8HR-2T-N (Mitac / TYAN system board model TN85B8261)
Form Factor
2U rackmount, 850 x 448 x 87 mm
Processors
2 x AMD EPYC 9004 / 9005 Series, Socket SP5, up to 500 W cTDP per socket
Chipset
AMD SoC (no discrete chipset)
GPU Support
Up to 4 double-wide GPUs on 6 PCIe Gen5 x16 slots
Memory
24 x DDR5 DIMM slots, RDIMM / RDIMM-3DS, up to 6,144 GB, 6400 MHz at 2DPC, 12 channels per CPU
Drive Bays
8 x 2.5 in. front hot-swap NVMe U.2
Storage Backplane
4 x MCIO x8 connectors, NVMe backplane
Expansion
6 x PCIe Gen5 x16 slots via pre-installed risers
Riser Cards
M8261T85-LR32-2L (2 x HH/HL PCIe 5.0 x16), M8261T85-L32T-2F and M8261T85-R32T-2F (2 x FH/FL PCIe 5.0 x16 each)
Networking
2 x 10 GbE RJ-45 plus 1 x dedicated GbE for IPMI
BMC
ASPEED AST2600 with IPMI 2.0 / Redfish
Power Supply
(1+1) 2700 W hot-swap CRPS, 80 PLUS Titanium; AC 100-127 V / 14 A, AC 200-240 V / 15.5 A, 50/60 Hz
Cooling
8 x 60 x 60 mm hot-swap middle fans plus 2 x 60 x 60 mm (or 2 x 80 mm) rear fans
I/O
2 x USB 3.2 Gen1 front, 2 x USB 3.2 Gen1 rear, 1 x VGA (D-sub 15-pin)
Management
ID button, power button, reset button; out-of-band management via dedicated GbE
Overview
The TYAN B8261 series is a dual-socket SP5 2U platform built around four double-wide GPUs. With two EPYC 9004 or 9005 processors at up to 500 W cTDP each and 24 DDR5 DIMM slots, it is sized for AI inference, HPC simulation and virtualisation clusters that need GPU density without moving to a 4U or 8U chassis.
Memory capacity reaches 6 TB with 64 GB RDIMMs across all 24 slots at 6400 MHz in the two-DIMM-per-channel configuration, which is the amount of host memory that large language model inference, genomics and CFD workloads actually consume alongside the accelerator memory.
Storage and I/O are both Gen5. Eight front hot-swap NVMe U.2 bays hang off four MCIO x8 connectors, and six PCIe Gen5 x16 slots are available through pre-installed risers, so network cards, NVMe switch adapters or additional accelerators can be added without custom bracketry. Power is 1+1 redundant 2700 W CRPS at 80 PLUS Titanium, and the 850 mm depth fits standard AI rack footprints.
Key Benefits
Four double-wide GPUs in 2U with dual SP5 sockets. 6 TB DDR5-6400 across 24 DIMM slots. Eight front NVMe U.2 bays on MCIO x8. Six PCIe Gen5 x16 slots via pre-installed risers. 1+1 2700 W Titanium CRPS for dense accelerator loads. AST2600 BMC with IPMI / Redfish.
Applications
AI inference and fine-tuning clusters; HPC simulation nodes; VDI and virtualisation hosts with GPU pass-through; genomics and CFD; edge-to-core AI deployment where 4U/8U is too tall.
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