Specifications
MPN
LCMXO3LF-6900C-6BG400I
Device
MachXO3LF-6900
Family
Lattice MachXO3LF
Package
BG400 (400-ball caBGA)
Speed Grade
6
Temperature Grade
I — industrial (-40 °C to +100 °C Tj)
Density (LUTs)
6,900
Distributed RAM (kbit)
54
EBR SRAM (kbit)
240
User Flash Memory (UFM, kbit)
256
PLLs
2
Core Voltage
1.2 V (also 2.5 V / 3.3 V VCC variants)
Configuration
Instant-on, non-volatile single-chip
I/O Standards
LVCMOS, LVTTL, LVDS, PCI, SSTL, HSTL
Toolchain
Lattice Diamond / Radiant
Vendor
Lattice Semiconductor
Overview
The MachXO3LF-6900 (ordering code LCMXO3LF-6900C-6BG400I) is Lattice's largest MachXO3LF device: 6,900 look-up tables, 54 kbit of distributed RAM, 240 kbit of embedded block RAM and 256 kbit of user flash memory in a 400-ball caBGA. MachXO3LF combines an instant-on, non-volatile configuration flash with SRAM-based logic, so the device is live milliseconds after power-up and needs no external configuration PROM.
That combination — instant-on, single-chip, low power, and a core that runs from 1.2 V with 2.5 V or 3.3 V I/O — makes the family the default choice for board glue logic: power-up sequencing, reset control, clock and I2C multiplexing, GPIO expansion, voltage-monitor supervision, and bridging between mismatched bus widths or voltage domains on server, storage, networking and industrial boards. Two PLLs provide clock multiplication and phase shifting. Designs are built in Lattice Diamond or Radiant. We supply the LCMXO3LF-6900C-6BG400I factory-sealed through distribution channels — contact us for availability, lead time and pricing.
Key Benefits
Instant-on non-volatile configuration with no external PROM; single 1.2 V core with 3.3 V-tolerant I/O; very low static power for always-on board management; 256 kbit of user flash for configuration and calibration data.
Applications
Server and storage board glue logic and power sequencing, industrial control and I/O expansion, communication line-card clock and bus bridging, automotive and consumer multi-voltage interfacing.
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