Specifications

MPN

XCVC1902-2MSEVSVA2197

Device

XCVC1902

Family

AMD Versal AI Core Series (VC)

Package

VSVA2197 (2197-ball FCBGA)

Speed Grade

-2

Temperature Grade

E — extended (0 °C to +100 °C Tj)

AI Engines

400

DSP Engines

1,968

System Logic Cells (K)

1,968

LUTs

899,840

Application Processing Unit

Dual-core Arm Cortex-A72, 48 KB / 32 KB L1 with parity & ECC, 1 MB L2 with ECC

Real-time Processing Unit

Dual-core Arm Cortex-R5F, 32 KB / 32 KB L1, 256 KB TCM with ECC

On-chip Memory

256 KB with ECC

Connectivity

Ethernet (x2), USB 2.0 (x1), UART (x2), SPI (x2), I2C (x2), CAN-FD (x2)

Toolchain

AMD Vivado / Vitis unified software platform

Vendor

AMD

Overview

The XCVC1902 (ordering code XCVC1902-2MSEVSVA2197) is an AMD Versal AI Core series adaptive compute acceleration platform (ACAP) in the VSVA2197 package. It combines 400 AI Engines and 1,968 DSP engines with 1,968K system logic cells (899,840 LUTs) of programmable logic and a hardened embedded processing system — a dual-core Arm Cortex-A72 application unit with 1 MB of ECC-protected L2 cache and a dual-core Arm Cortex-R5F real-time unit with 256 KB of TCM.

Versal is AMD's heterogeneous compute architecture: the AI Engines deliver deterministic, low-latency inference throughput without consuming programmable logic, which makes the family the usual choice for radar, 5G beamforming, medical imaging and automotive sensor-fusion designs that cannot tolerate an accelerator on a PCIe bus. The integrated 256 KB on-chip memory is ECC protected and the device carries Ethernet, USB 2.0, UART, SPI, I2C and CAN-FD connectivity. Designs are built with AMD Vivado and Vitis. We supply the XCVC1902-2MSEVSVA2197 factory-sealed through distribution channels — contact us for availability, lead time and pricing.

Key Benefits

Deterministic low-latency AI inference on hardened AI Engines rather than a PCIe accelerator; compute density in a single BGA; ECC-protected memory throughout; AMD Vivado/Vitis toolchain.

Applications

Radar and electronic warfare, 5G massive-MIMO beamforming, medical imaging and diagnostics, automotive sensor fusion and ADAS, industrial machine vision, data-centre smart NIC and compute offload.

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