Specifications

MPN

XCVC1802-2MSEVSVA2197

Device

XCVC1802

Family

AMD Versal AI Core Series (VC)

Package

VSVA2197 (2197-ball FCBGA)

Speed Grade

-2

Temperature Grade

E — extended (0 °C to +100 °C Tj)

AI Engines

300

DSP Engines

1,600

System Logic Cells (K)

1,586

LUTs

725,000

Application Processing Unit

Dual-core Arm Cortex-A72, 48 KB / 32 KB L1 with parity & ECC, 1 MB L2 with ECC

Real-time Processing Unit

Dual-core Arm Cortex-R5F, 32 KB / 32 KB L1, 256 KB TCM with ECC

On-chip Memory

256 KB with ECC

Connectivity

Ethernet (x2), USB 2.0 (x1), UART (x2), SPI (x2), I2C (x2), CAN-FD (x2)

Toolchain

AMD Vivado / Vitis unified software platform

Vendor

AMD

Overview

The XCVC1802 (ordering code XCVC1802-2MSEVSVA2197) is an AMD Versal AI Core series adaptive compute acceleration platform (ACAP) in the VSVA2197 package. It combines 300 AI Engines and 1,600 DSP engines with 1,586K system logic cells (725,000 LUTs) of programmable logic and a hardened embedded processing system — a dual-core Arm Cortex-A72 application unit with 1 MB of ECC-protected L2 cache and a dual-core Arm Cortex-R5F real-time unit with 256 KB of TCM.

Versal is AMD's heterogeneous compute architecture: the AI Engines deliver deterministic, low-latency inference throughput without consuming programmable logic, which makes the family the usual choice for radar, 5G beamforming, medical imaging and automotive sensor-fusion designs that cannot tolerate an accelerator on a PCIe bus. The integrated 256 KB on-chip memory is ECC protected and the device carries Ethernet, USB 2.0, UART, SPI, I2C and CAN-FD connectivity. Designs are built with AMD Vivado and Vitis. We supply the XCVC1802-2MSEVSVA2197 factory-sealed through distribution channels — contact us for availability, lead time and pricing.

Key Benefits

Deterministic low-latency AI inference on hardened AI Engines rather than a PCIe accelerator; compute density in a single BGA; ECC-protected memory throughout; AMD Vivado/Vitis toolchain.

Applications

Radar and electronic warfare, 5G massive-MIMO beamforming, medical imaging and diagnostics, automotive sensor fusion and ADAS, industrial machine vision, data-centre smart NIC and compute offload.

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