Specifications
MPN
XCVC1802-2MSEVSVA2197
Device
XCVC1802
Family
AMD Versal AI Core Series (VC)
Package
VSVA2197 (2197-ball FCBGA)
Speed Grade
-2
Temperature Grade
E — extended (0 °C to +100 °C Tj)
AI Engines
300
DSP Engines
1,600
System Logic Cells (K)
1,586
LUTs
725,000
Application Processing Unit
Dual-core Arm Cortex-A72, 48 KB / 32 KB L1 with parity & ECC, 1 MB L2 with ECC
Real-time Processing Unit
Dual-core Arm Cortex-R5F, 32 KB / 32 KB L1, 256 KB TCM with ECC
On-chip Memory
256 KB with ECC
Connectivity
Ethernet (x2), USB 2.0 (x1), UART (x2), SPI (x2), I2C (x2), CAN-FD (x2)
Toolchain
AMD Vivado / Vitis unified software platform
Vendor
AMD
Overview
The XCVC1802 (ordering code XCVC1802-2MSEVSVA2197) is an AMD Versal AI Core series adaptive compute acceleration platform (ACAP) in the VSVA2197 package. It combines 300 AI Engines and 1,600 DSP engines with 1,586K system logic cells (725,000 LUTs) of programmable logic and a hardened embedded processing system — a dual-core Arm Cortex-A72 application unit with 1 MB of ECC-protected L2 cache and a dual-core Arm Cortex-R5F real-time unit with 256 KB of TCM.
Versal is AMD's heterogeneous compute architecture: the AI Engines deliver deterministic, low-latency inference throughput without consuming programmable logic, which makes the family the usual choice for radar, 5G beamforming, medical imaging and automotive sensor-fusion designs that cannot tolerate an accelerator on a PCIe bus. The integrated 256 KB on-chip memory is ECC protected and the device carries Ethernet, USB 2.0, UART, SPI, I2C and CAN-FD connectivity. Designs are built with AMD Vivado and Vitis. We supply the XCVC1802-2MSEVSVA2197 factory-sealed through distribution channels — contact us for availability, lead time and pricing.
Key Benefits
Deterministic low-latency AI inference on hardened AI Engines rather than a PCIe accelerator; compute density in a single BGA; ECC-protected memory throughout; AMD Vivado/Vitis toolchain.
Applications
Radar and electronic warfare, 5G massive-MIMO beamforming, medical imaging and diagnostics, automotive sensor fusion and ADAS, industrial machine vision, data-centre smart NIC and compute offload.
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