Specifications
Product
8Gb DDR4 DRAM on in-house 16nm process
Data Rate
Up to 3600 Mbps (industry-first for DDR4)
Process
16nm, in-house
Targets
TV, servers, networking, industrial PCs, embedded
Power
Improved power efficiency, reduced leakage
Signal Integrity
Enhanced for stable operation up to 3600 Mbps
Die Size
Smaller die yields higher wafer productivity and lower system cost
Supply Chain
Full in-house design, 16nm process development and manufacturing (Taiwan)
KGD
Supports Known Good Die customers with stable supply
Roadmap
CUBE, 8Gb LPDDR4 and 16Gb DDR4 under development on 16nm
Portfolio
Specialty DRAM, Mobile DRAM, Code Storage Flash, TrustME Secure Flash
Temperature
Industrial / long-lifecycle support
Vendor
Winbond Electronics Corporation (Taiwan)
Applications
Industrial PCs, embedded systems, networking and server boot/buffer memory
Overview
Winbond's 8Gb DDR4 DRAM is built on the company's own 16nm process and pushes DDR4 data rates to 3600 Mbps, an industry first for the standard. The smaller die, higher wafer productivity and reduced leakage lower total system cost while improving signal integrity for stable high-speed operation.
While many designs migrate to DDR5, DDR4 remains the backbone of long-lifecycle industrial, networking and embedded platforms. Winbond backs the part with fully in-house design, process and manufacturing, plus Known Good Die support, and has CUBE, 8Gb LPDDR4 and 16Gb DDR4 in development on the same node.
Key Benefits
3600 Mbps DDR4 squeezes more bandwidth from legacy-compatible designs. 16nm in-house process lowers cost and power. Long-lifecycle industrial support with KGD. Broad portfolio spanning specialty DRAM, mobile DRAM and secure flash.
Applications
Industrial PCs and embedded systems, networking equipment, TV and consumer platforms, and server boot or buffer memory where DDR4 longevity matters.
Request a Quote — WINBOND 16NM SPECIALTY DRAM — 8GB DDR4 WITH 3600 MBPS INDUSTRIAL SPEED GRADE
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