Specifications
Series
F4SN / F4SE (SODIMM), F4UN (UDIMM)
Capacities
4 GB, 8 GB, 16 GB, 32 GB
Form Factors
DDR4 SODIMM (69.60 x 30.00 mm), DDR4 UDIMM (133.35 x 31.25 mm)
Data Rate
3200 Mbps
CL Value
CL22
Timing
22-22-22
Clock
1600 MHz
Operating Voltage
1.2 V
Architectures
1R x 16, 1R x 8, 2R x 8
ECC Options
Without ECC (F4SN / F4UN) and with ECC (F4SE)
Operating Temperature
-40 C to +85 C (F4SNW), -25 C to +85 C (F4SNM), 0 C to +85 C (F4SNS / F4SES / F4UNS)
Gold Fingers (Edge Connectors)
30 micro-inch
Manufacturing Site
Longsys Zhongshan Storage Industrial Park
Compatible Platforms
Intel and AMD platforms (mainstream list published by vendor)
Example PNs
F4SNW-8GHE32A000 (8 GB SODIMM, -40 C), F4SNW-RGHC32C000 (32 GB SODIMM, -40 C), F4SES-QGHE32C000 (16 GB ECC SODIMM), F4UNS-QGHD32A000 (16 GB UDIMM)
Price
Quote upon request
Availability
Available
Overview
Longsys FORESEE industrial DDR4 modules are DDR4-3200 parts with CL22 timing at 1.2 V, offered as SODIMMs (69.60 x 30.00 mm) and UDIMMs (133.35 x 31.25 mm) in 4 GB, 8 GB, 16 GB and 32 GB densities across 1R x 16, 1R x 8 and 2R x 8 organisations. The three-letter suffix identifies the temperature bin: F4SNW for -40 C to +85 C, F4SNM for -25 C to +85 C and F4SNS for 0 C to +85 C.
ECC variants are carried under the F4SE family for applications where single-bit correction in the memory path matters — machine-vision controllers, medical instruments and edge servers operating outside temperature-controlled rooms. Non-ECC parts cover mainstream industrial PCs and HMIs.
The modules are produced at Longsys' Zhongshan Storage Industrial Park and are characterised for stability in extreme environments, with 30 micro-inch gold plating on the edge connectors, a complete retention cycle for core customer-procured materials, and vendor-published Intel and AMD platform compatibility lists.
For designers upgrading existing industrial platforms that still carry DDR4 SODIMM or UDIMM slots, wide-temperature FORESEE modules let a validated board run in outdoor cabinets, vehicles and unheated factory floors without changing memory architecture.
Key Benefits
-40 C to +85 C options in DDR4 SODIMM and UDIMM form factors. ECC and non-ECC variants in the same family. Up to 32 GB at 3200 Mbps, CL22. 30 micro-inch gold edge connectors for repeated insertion cycles. Intel and AMD platform validation published by the vendor.
Applications
Industrial PCs, HMIs and panel computers in unheated environments; outdoor telecom and energy cabinets; in-vehicle and railway computing; machine-vision controllers needing ECC; medical and analytical instruments; legacy industrial platform refreshes.
Request a Quote — LONGSYS FORESEE INDUSTRIAL DDR4 DIMM — -40 TO 85 C SODIMM AND UDIMM, 4 GB TO 32 GB
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