Viking Technology DRAM Memory Stacking (3DS) — DDR4/DDR3/DDR2 Modules to 128GB

Specifications

Overview

There is a limit to how much memory fits on a DIMM through packaging density alone, and in embedded and telecom designs there is an even harder limit on how large the DIMM can be. Viking Technology's memory stacking sidesteps both by integrating DRAM die vertically rather than spreading them across the board. The result is server-class density inside the VLP and Mini footprints that embedded platforms can actually accept.

The current line reaches 128GB on DDR4 modules and 64GB on DDR3 modules, with legacy DDR2 stacks to 16GB, at speeds up to 2666 MT/s. Densities are available across LRDIMM, RDIMM, VLP RDIMM, VLP MiniRDIMM and VLP SORDIMM footprints — so a 128GB RDIMM and a 64GB VLP SORDIMM are the same technology at different mechanical scales. The stacking approach is not restricted to DRAM: flash and MRAM can be integrated the same way.

The engineering case is not only density. Short die-to-die interconnects give strong signal integrity, and stacked die distribute heat across the package rather than concentrating it. Manufacturing uses a standard reflow process with zero compound yield loss, which matters when a design moves from prototype to volume. Viking also positions the approach as a supply-chain lever: density can be tuned to the DRAM supply situation rather than being locked to what a single package offers.

The applications Viking lists are the familiar density-pressured ones: embedded systems such as uServer and industrial PCs, AdvancedTCA and MicroTCA line cards, high-density SSD designs, blade servers and any space-constrained OEM design.

QS Compute sources stacked memory modules to project specification, including the unusual density and footprint combinations that standard distribution does not carry.

Key Benefits

Server-class density in embedded footprints — up to 128GB DDR4 in VLP and Mini module shapes. Speeds to 2666 MT/s with good signal integrity from short die-to-die interconnects. Standard reflow manufacturing with zero compound yield loss. Media flexibility — DRAM, flash and MRAM can all be stacked. Supply-chain leverage — density tuned to what DRAM supply allows.

Applications

Embedded servers (uServer) and industrial PCs · AdvancedTCA and MicroTCA line cards · high-density SSD designs · blade servers · space-constrained OEM designs · telecom and rugged platforms needing maximum memory per cubic inch

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