SK hynix GDDR7 24Gb — 3GB GDDR7 Modules at 48Gbps

Specifications

Overview

SK hynix's 24Gb GDDR7 die is the 3-gigabyte-per-module entry in the GDDR7 generation. Increasing the die density from 16Gb to 24Gb raises module capacity from 2GB to 3GB while keeping the same package footprint, which is what allows a board to reach 24GB or more of graphics memory without widening the bus or adding device positions.

The headline number is pin speed: 48Gbps, up from the 28Gbps of first-generation GDDR7 parts. That takes a single GDDR7 module from roughly 112GB/s to as much as 192GB/s — over 70% more bandwidth per device. SK hynix positioned the part for mid-range AI inference as well as graphics, which reflects the fact that a growing share of AI accelerator boards, particularly those built for markets where HBM is restricted on export grounds, are turning to GDDR7 as their memory layer.

The device was disclosed at IEEE ISSCC 2026 in the DRAM, SRAM and Non-Volatile Memories session, on a 1cnm-class process. Standard GDDR7 PAM3 signalling is retained, so board designs that already route GDDR7 can adopt the higher-density part without a signalling change.

QS Compute supplies GDDR7 and AI accelerator memory for board-level and system-level integration. Contact us for availability, density options and pricing on 24Gb GDDR7 modules.

Key Benefits

3GB per module raises board memory capacity in the same footprint. 48Gbps pin speed delivers up to 192GB/s per module — over 70% more than 28Gbps GDDR7. Standard GDDR7 PAM3 signalling means no board re-design to adopt it. Targets mid-range AI inference, not just graphics, matching where GDDR7-based accelerators are growing fastest.

Applications

AI inference accelerator boards, graphics and workstation GPUs, RTX-class add-in cards, edge AI compute modules, and video/graphics workloads requiring high memory bandwidth per watt.

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