Specifications
Product Family
Renesas Gen 3 DDR5 MRDIMM chipset
MRCD
RRG5013 / RRG5013x multiplexed registering clock driver
MDB
RRG5103 / RRG5103x multiplexed data buffer
Module Speed
Up to 16,000 MT/s (MRDIMM)
Bandwidth Gain
25% higher memory bandwidth than Gen 2 MRDIMM
Compatibility
Reuses existing DDR5 infrastructure and DIMM form factors
New Feature
Device Equalization Self-Train Mode (DESTM) quality indication status
Platform Components
MRCD, MDB, PMIC, SPD hub and temperature sensor
Target Workloads
AI training/inference, HPC, cloud and accelerated compute
Process/Integration
Server-class DDR5 memory interface silicon
Sampling
Sampling to select customers including all major DRAM suppliers
Production
Expected 2H/2027
Showcase
FMS 2026 (Future of Memory and Storage), Santa Clara
Ecosystem
Validated with AMD and major CPU/platform partners
Overview
MRDIMM (multiplexed rank DIMM) extends the DDR5 roadmap by placing a multiplexed registering clock driver (MRCD) and multiplexed data buffer (MDB) on the module, so one module serves two ranks at high speed. Renesas' Gen 3 chipset lifts that to 16,000 MT/s — a 25% bandwidth step over Gen 2 — while keeping standard DIMM form factors and existing DDR5 infrastructure.
The Gen 3 pair is the MRCD RRG5013 and the MDB RRG5103. Renesas sells them as part of a full platform that also includes the PMIC, SPD hub and temperature sensor, which is what server OEMs need to design a complete module. A new Device Equalization Self-Train Mode (DESTM) status lets module designers tune receiver equalisation to maximise timing margin.
Design relevance: MRDIMM is the capacity-and-bandwidth path that sits between conventional RDIMM and HBM for AI servers — it raises main-memory bandwidth without changing the memory controller interface. Sampling is underway now; production is expected in the second half of 2027.
Key Benefits
16,000 MT/s MRDIMM, +25% bandwidth over Gen 2, drop-in DDR5 infrastructure compatibility, a complete chipset (MRCD + MDB + PMIC + SPD + temp sensor), and DESTM margin-tuning status for module designers.
Applications
AI and HPC server platforms, cloud infrastructure memory expansion, and next-generation data center main memory where RDIMM bandwidth is the limiting factor.
Request a Quote — RENESAS GEN 3 MRDIMM CHIPSET — DDR5 MRCD RRG5013 + MDB RRG5103
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