Specifications
CPU
AMD Ryzen AI 9 HX 370 — 12 Zen 5 cores / 24 threads, 4nm, up to 5.1 GHz
GPU
AMD Radeon 890M — 16 CU RDNA 3.5 @ 2900 MHz
NPU
AMD Ryzen AI XDNA 2 — 50 TOPS
Memory
128-bit DDR5-5600, 2x SODIMM, up to 128 GB unified, ECC supported
Storage
Up to 3x NVMe PCIe Gen4 x4 (M.2 2280); power-loss-protected NVMe option
Networking
4x 2.5GbE (Intel I226) — or 2x GbE + 4 displays in the NIO R7000 configuration
Display
Up to 4 outputs: HDMI 2.1 + DisplayPort 2.1 (configuration dependent)
USB
USB4 40 Gbps, plus 4x USB 3.2 and a console port
Wireless
Optional 5G modem with dual SIM
AI acceleration options
Up to 2x Hailo-8 M.2 (26 TOPS each) or 2x Hailo-10 M.2 (40 TOPS each)
Cooling
Fanless, ventless — liquid metal TIM plus stacked heat pipes, 360-degree all-aluminium chassis
Cooling performance
Dissipates over 3x the power of fanless computers of similar size
Power input
DC terminal block with screw locking, wide 12V-60V, two-stage regulation
Power control
Configurable CPU power limit from 8W to 54W
Enclosure
All-aluminium, fanless, ventless, dust-resistant, IP40 — no maintenance required
Mounting
Lever-locking DIN-rail bracket, wall mount, small stand or ruggedised stand
Reliability
TPM, watchdog timer, redundant SPI flash (anti-brick BIOS), ECC RAM
Software
AMD ROCm 7.x on Windows and Linux; native RDNA 3.5 + XDNA 2 AI framework support
Modular architecture
SoM + NIO + SX + PM boards — mix-and-match off-the-shelf; ODM service available
OS support
Windows 11, Windows 10, Linux
RFQ lead time
15-day sample lead time; volume pricing on request
Overview
The SolidRun Bedrock RAI300 is a fanless industrial PC engineered specifically for edge AI inference. It pairs the AMD Ryzen AI 9 HX 370 processor — 12 Zen 5 cores and 24 threads boosting to 5.1 GHz — with a Radeon 890M RDNA 3.5 graphics engine and an XDNA 2 neural processing unit rated at 50 TOPS. Because CPU, GPU and NPU draw on a unified DDR5 memory pool of up to 128 GB, the RAI300 can host large generative models and LLM workloads previously confined to datacenter hardware.
Thermal design is the defining engineering feature. SolidRun couples the processor to the chassis with liquid-metal thermal interface material, then distributes heat through stacked heat pipes into a 360-degree all-aluminium enclosure. Each wall carries two heat-exchange layers: aluminium air ducts that drive airflow through a chimney effect, plus conventional cooling ribs. The result is a ventless, fanless system that dissipates more than three times the power of comparably sized fanless computers — with zero moving parts and no filter maintenance.
For AI software teams, the most practical advantage is AMD ROCm 7.x support on both Windows and Linux. Cloud-trained models become portable to the edge without a framework rewrite, and the modular SoM + NIO + SX + PM board architecture lets integrators change I/O personality, power input and mounting without a new mechanical design.
Key Benefits
Zero moving parts: fanless, ventless IP40 chassis removes the largest single failure mode in industrial deployments. 128 GB unified memory: run large LLMs and generative models locally instead of streaming to cloud. 50 TOPS NPU plus RDNA 3.5: hardware-accelerated inference with ROCm 7.x on Windows and Linux. Flexible power: 12V-60V DC input with an 8W-54W configurable CPU limit lets one SKU serve both power-constrained and performance-first projects. Expandable AI: add up to two Hailo-8 or Hailo-10 M.2 accelerators for an additional 52-80 TOPS.
Applications
Industrial machine vision and quality inspection; autonomous mobile robots and AGV fleets; physical AI and VLA research platforms; smart-city and transportation video analytics; medical imaging and diagnostic edge systems; 5G-enabled remote-site AI; laboratory and research edge servers; OEM/ODM edge appliances built on SolidRun building blocks.
Request a Quote — SOLIDRUN BEDROCK RAI300 — FANLESS EDGE AI INDUSTRIAL PC WITH AMD RYZEN AI 9 HX 370
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