Specifications
Model
FSP3200-21HE
Total Output Power
3200 W
Main Output
54 V DC (high-voltage DC bus)
Form Factor
CRPS redundant module, 1U
Efficiency Certification
80 PLUS Titanium
Peak Power Feature
EDPP — Electrical Design Power Peaks
Monitoring
PMBus digital interface
Distribution Benefit
Lower current at equal power, reducing I²R losses in busbars and interconnects
Target Platforms
Multi-GPU AI servers, high-density accelerator racks
Thermal Benefit
Reduced conductor heating preserves GPU inlet thermal headroom
Announcement
Launched August 2026 alongside the 12 V FSP3200-20HM
Overview
The FSP3200-21HE is the 54 V half of FSP Group's August 2026 3200 W CRPS launch. Raising the distribution bus from 12 V to 54 V cuts current by roughly 4.5x at the same power level, which directly reduces resistive losses in busbars, cables and board interconnects.
That matters in dense multi-GPU chassis where conductor heating steals thermal headroom from accelerator inlets. It is the supply side of the industry move toward high-voltage DC rack distribution, packaged in a 1U CRPS module with 80 PLUS Titanium certification and EDPP transient headroom.
It pairs naturally with ORV3-class power shelves and 48-54 V bus infrastructure already used in Open Rack deployments.
Key Benefits
54 V bus cuts I²R losses versus 12 V at the same wattage. Less conductor heating preserves thermal headroom for the GPUs themselves. 3200 W Titanium in 1U supports the highest per-slot power in a CRPS footprint. EDPP peak capability rides out accelerator transient surges.
Applications
Multi-GPU training and inference servers on 48-54 V distribution; Open Rack V3 (ORV3) style deployments; next-generation AI racks where busbar loss and cable heating are the limiting factor; high-density storage shelves migrating to HVDC.
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