Specifications
Vendor
Ligent Technologies, Inc. (纳真科技)
1.6T Configurations
1.6T OSFP 2xDR4 and 1.6T OSFP 2xFR4
1.6T Architectures
Full DSP, LPO (linear pluggable optics), and LRO / TRO (linear receive optics)
Per-Lane Rate
8 x 200G PAM4 (200G per lane)
800G (200G/lane)
800G OSFP FR4, 800G OSFP DR4
800G (100G/lane)
800G OSFP 2xDR4/DR8, 800G OSFP 2xFR4, plus LRO/TRO and LPO variants
400G
Pluggable transceivers for data-center and telecom
CW-DFB Lasers
100 mW CW-DFB — for 1.6T 2xDR4 and 2xFR4 SiPh transceivers
DFB Lasers
25G DFB, 2.5G to 25G, tunable across 1270-1650 nm
Optical Engine
Silicon-photonics based
Roadmap
800G to 1.6T to 3.2T, with NPO / CPO / XPO R&D
Application Protocols
Ethernet, InfiniBand and PCIe datacom
Markets
AI clusters, hyperscale data centers, 5G transport, FTTx
Overview
Ligent Technologies supplies high-speed optical transceivers and optical chips for AI clusters and hyperscale data centers, with an in-house laser-chip and module portfolio spanning 400G, 800G and 1.6T and a roadmap toward 3.2T plus near-packaged, co-packaged and external pluggable optics.
Its 1.6T OSFP family is offered in 2xDR4 and 2xFR4 configurations across three architectural approaches — full DSP, LPO and LRO/TRO — all built on 8 x 200G PAM4 lanes. The 800G tier covers both 200G-per-lane (OSFP FR4/DR4) and 100G-per-lane (2xDR4/DR8, 2xFR4 plus LPO and LRO) modules.
Vertically, Ligent produces its own laser chips, including 100 mW CW-DFB lasers used in 1.6T 2xDR4 and 2xFR4 silicon-photonics transceivers and 25G DFB lasers for telecom spanning 1270-1650 nm, giving it control over both chip and module level.
Key Benefits
Three 1.6T architectures (DSP, LPO, LRO) let operators trade power against reach and interoperability; in-house CW-DFB and DFB laser chips improve supply resilience; broad 800G coverage supports staged 1.6T migration; 3.2T roadmap with NPO/CPO/XPO R&D future-proofs deployments.
Applications
AI-cluster and hyperscale data-center optical interconnect, 800G-to-1.6T switch uplinks, scale-up and scale-out fabrics, 5G transport and FTTx access.
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