Specifications
Vendor
congatec
Product
conga-HPC/cRX1
Form Factor
COM-HPC Client Size C (120 x 160 mm)
Processor
AMD Ryzen AI Embedded X100 Series
CPU Cores
Up to 16 Zen 5 cores / 32 threads
GPU
Up to 40 AMD Radeon RDNA 3.5 compute units
NPU
AMD XDNA 2, 50 TOPS
Memory
Up to 128 GB LPDDR5X-8533 (soldered)
Onboard Storage
Up to 512 GB NVMe (option)
PCIe
Up to 24 x PCIe Gen4 lanes
Networking
2 x 2.5 GbE
USB
Up to 4 x USB 3.2 Gen2, up to 8 x USB 2.0
SATA
Up to 2 x SATA 6 Gb/s
Operating Temperature
-40 °C to +85 °C
TDP
45 W to 120 W (55 W base)
Overview
The conga-HPC/cRX1 is congatec's COM-HPC Client Size C module based on AMD Ryzen AI Embedded X100 Series processors. It tops out at 16 Zen 5 CPU cores, up to 40 AMD Radeon RDNA 3.5 GPU compute units and a dedicated AMD XDNA 2 NPU rated at 50 TOPS, with up to 128 GB of soldered LPDDR5X-8533 unified memory.
Designed for compute-intensive physical-AI applications at the rugged edge, the module spans a 45 W to 120 W configurable TDP and an industrial -40 °C to +85 °C range. Up to 24 PCIe Gen4 lanes, dual 2.5 GbE, multiple USB and SATA links and an optional onboard PCIe switch give system designers wide flexibility. Target markets include robotics, autonomous commercial vehicles, medical technology and industrial automation.
Key Benefits
Up to 16 Zen 5 cores + 40 RDNA 3.5 CUs · 50 TOPS XDNA 2 NPU · up to 128 GB LPDDR5X-8533 · COM-HPC Client Size C · -40 to +85 °C · 45-120 W configurable TDP.
Applications
Robotics and autonomous vehicles, medical imaging and diagnostics, industrial automation, and compute-intensive physical-AI edge systems.
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