Specifications
Module standard
COM-HPC Mini
Processor
Qualcomm Dragonwing IQ-X Series
Processor packaging
System-in-Package (SiP)
Memory
Up to 64 GB soldered LPDDR5x at 8400 MT/s
Scalability
15 W to 45 W TDP across the processor range
Operating temperature
-40 C to +85 C industrial range
Camera inputs
2x 4-lane CSI inputs supporting cameras up to 36 MP at 30 fps
Storage interface
UFS 4.0 up to 1 TB
PCIe
PCIe Gen 4
High-speed I/O
USB4
Graphics / media
Rich multimedia and display support within the SoC
Operating systems
Linux Yocto, Ubuntu and Windows on Arm
Windows on Arm role
Opens deployment options where Arm and x86 software environments converge
SWaP benefit
Soldered memory and high performance-per-watt reduce thermal management burden
Target applications
Drones, autonomous vehicles, industrial automation, mobile medical systems and outdoor video surveillance
Integration model
Designed into customer carrier boards for streamlined OEM development
Vendor breadth
Part of congatec's industrial COM portfolio alongside COM Ultra Series 3 modules
Overview
congatec's COM-HPC Mini modules built on Qualcomm Dragonwing IQ-X processors give industrial designers a standardised path to Qualcomm's high-efficiency edge AI compute. Because the processor ships as a System-in-Package with up to 64 GB of soldered LPDDR5x running at 8400 MT/s, the module avoids the connector and routing penalties that limit socketed memory designs — and soldered memory at that bandwidth is exactly what high-performance-per-watt edge inference needs.
The modules scale from 15 W to 45 W TDP and are rated for the full -40 C to +85 C industrial temperature range, which is what makes them viable in outdoor video surveillance, drones, mobile medical systems and vehicle-mounted equipment rather than only in climate-controlled cabinets. I/O is modern and camera-heavy: two 4-lane CSI inputs supporting sensors up to 36 MP at 30 fps, PCIe Gen 4, USB4 and UFS 4.0 storage up to 1 TB.
A distinguishing feature is operating system breadth. Beyond the usual Linux Yocto and Ubuntu images, congatec supports Windows on Arm on these modules — relevant for industrial customers with existing Windows tooling and applications who want Arm efficiency without rewriting their stack. The modules are designed to be integrated into customer carrier boards, and sit alongside congatec's Intel-based COM Ultra Series 3 modules in the same industrial portfolio.
Key Benefits
High performance per watt with wide temperature — 15-45 W scalable TDP and -40 C to +85 C operation from a Dragonwing IQ-X SiP with up to 64 GB soldered LPDDR5x at 8400 MT/s. Camera-heavy I/O with dual 4-lane CSI up to 36 MP at 30 fps plus PCIe Gen 4, USB4 and UFS 4.0, and Windows on Arm support alongside Linux Yocto and Ubuntu.
Applications
Drones and unmanned platforms, autonomous vehicles, industrial automation and robotics, mobile medical systems, outdoor video surveillance, and SWaP-optimised edge AI nodes in harsh environments.
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