Specifications
Processor
Qualcomm Dragonwing IQ-2390, first device in the industrial IQ2 Series
CPU
Quad-core Qualcomm Kryo
GPU
Qualcomm Adreno 704 with 3D graphics
NPU
1.1 TOPS on-device AI acceleration
Real-Time Core
Integrated RISC-V microcontroller
Vision Pipeline
Integrated ISP for local vision processing
Audio
Integrated audio DSP
Display
5-inch touchscreen, 800 x 480 resolution
Enclosure
Panel-mount, 145.5 x 102.4 x 33.4 mm
Front Panel Rating
IP65
Memory
2 GB or 4 GB RAM
Storage
16 GB eMMC
Networking
Dual Gigabit Ethernet with Time-Sensitive Networking (TSN)
Serial Interfaces
RS232 and RS485
Fieldbus
CAN bus
USB
USB-C
Power Input
9 V to 24 V DC
Operating System
Clea OS 2.0, Yocto-Linux based; Clea OS 3.0 planned
Security and Lifecycle
Secure Boot, OTA software updates, remote device management, Docker-based application management
Processor Thermal Grade
-30 °C to +115 °C with shock and vibration hardening
Optional Accessory
SECO AI Audio Dongle — beamforming microphone array, 3 W mono speaker, 2592 x 1944 autofocus camera
Planned Variants
4.3-inch and 7-inch display sizes
Overview
The SECO Compact Vision 5 Dragonwing IQ-2390 collapses an industrial operator panel and an edge AI computer into one panel-mounted assembly measuring 145.5 x 102.4 x 33.4 mm. It is built on the Qualcomm Dragonwing IQ-2390, the first device in Qualcomm's industrial IQ2 Series, which combines application processing, machine vision, AI acceleration and deterministic networking on a single die.
The silicon mix is deliberately industrial rather than consumer. A quad-core Kryo CPU handles application logic, an Adreno 704 GPU covers 3D graphics, a 1.1 TOPS NPU runs on-device inference, an integrated ISP supports local vision processing, an audio DSP handles voice pipelines, and a separate RISC-V microcontroller provides real-time control. Qualcomm rates the IQ-2390 for -30 °C to +115 °C operation with shock and vibration hardening, which is what allows the same part inside a sealed panel on a factory floor.
Connectivity is aimed at machinery rather than office networks: dual Gigabit Ethernet with Time-Sensitive Networking for deterministic industrial traffic, plus RS232, RS485, CAN bus and USB-C. Memory is 2 GB or 4 GB with 16 GB of eMMC storage, and the 5-inch 800 x 480 touchscreen sits behind an IP65-rated front panel.
Software is unified across SECO's platform family. Clea OS 2.0 is a Yocto-Linux distribution with Secure Boot, OTA updates, remote device management and Docker-based application deployment, with Clea OS 3.0 planned. An optional SECO AI Audio Dongle adds a beamforming microphone array, a 3 W speaker and an autofocus camera for voice-driven HMI in noisy industrial environments.
Both the Compact Vision 5 and the companion SBC are currently available through SECO's Early Access Program; 4.3-inch and 7-inch variants are planned, and Qualcomm expects evaluation kits in early 2027.
Key Benefits
Panel PC and edge AI in one unit — no separate controller cabinet required. 1.1 TOPS NPU plus integrated ISP for on-device vision inference. Dual GbE with TSN for deterministic industrial Ethernet. IP65 front panel suited to washdown-adjacent environments. Clea OS with Secure Boot and OTA for fleet-scale lifecycle management.
Applications
Machine operator interfaces with on-device vision, vending and access-control terminals, compact industrial vision devices, building-automation panels, energy and utility HMI, and voice-enabled HMI using the optional AI Audio Dongle.
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