Specifications

NPU

Mobilint ARIES — 8 NPU cores at 1.25 GHz

AI Performance

80 TOPS (INT8)

Memory Type

LPDDR4X, onboard

Memory Capacity

16 GB / 32 GB

Memory Bandwidth

66.7 GB/s

Flash Memory

32 MB

Host Interface

PCI Express Gen4, 8-lane (MXM slot)

Form Factor

MXM module, Type A: 82 (L) x 70 (W) mm

Weight

110 g

Thermal Design Power

25 W

Input Voltage

DC +12 V

External Power Connector

Not required

Cooling System

Heatsink or fan cooling

Operating Temperature

-35 C to +65 C standard; -35 C to +75 C extended

UART

1 port

LED Indicators

2 (Power, Heartbeat)

Supported OS

Linux, Windows

Supported Frameworks

PyTorch, TensorFlow, TFLite, ONNX, Keras

SDK

Mobilint SDK qb

Price

Quote upon request

Availability

Available

Overview

The MLA100 MXM takes the ARIES NPU and packages it as an 82 x 70 mm MXM module that drops into any MXM-compatible carrier board. It delivers 80 TOPS of INT8 inference from eight NPU cores at 1.25 GHz with 16 GB or 32 GB of onboard LPDDR4X at 66.7 GB/s, all inside a 25 W envelope — and with no external power connector, since the module is fed from the host slot.

The module is specified for extended temperature operation: -35 C to +65 C as standard, with a -35 C to +75 C extended range for vehicle-mount and outdoor deployments. That temperature envelope, combined with the 82 x 70 mm footprint and 25 W power draw, targets industrial embedded systems where space, airflow and power are all constrained.

Typical integration targets published by Mobilint include industrial controllers, inspection systems and factory-automation equipment; UAV and drone payloads running vision and language workloads; AIoT devices and home appliances needing on-device voice, vision and language processing without cloud connectivity; and interactive kiosks requiring real-time product and user recognition.

Key Benefits

80 TOPS in a standard MXM slot — no carrier redesign required. 25 W with no auxiliary power connector. Extended -35 to +75 C range for industrial and vehicle-mount use. Same ARIES software stack as the MLA100/MLA400 PCIe cards.

Applications

Industrial controllers and factory automation; machine-vision inspection systems; UAV and robotics payloads; AIoT appliances and smart home robots; interactive kiosks; medical and analytical instruments requiring on-device inference.

Request a Quote — MOBILINT ARIES MLA100 MXM — 80 TOPS EDGE AI MODULE FOR EMBEDDED SYSTEMS

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