Specifications

Compute

1,835 TFLOPS BF16/FP8 Matrix

Memory

128GB HBM2e, 3.67 TB/s BW

Cores

64 TPC + 8 MME (Matrix Engines)

Networking

24×200GbE RoCE RDMA NICs

Interface

PCIe Gen5 x16 (128 GB/s)

TDP

600W, passive cooling

Process

TSMC 5nm

Form Factor

Dual-slot FHFL, 10.5" length

SKU

HL-338 PCIe CEM Card

Use Case

Deployed in hyperscale AI data centers, cloud GPU clusters, enterprise AI inference platforms, and HPC environments. Ideal for large language model training, distributed inference, vector databases, and real-time AI pipelines with demanding throughput requirements.

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