Specifications
SoC
AMD Zynq UltraScale+ RFSoC, XCZU48DR or XCZU43DR
SKUs
AM-XRU50-48DR-2C-D4E, AM-XRU50-43DR-1C-D3E
RF-ADC
8 x 14-bit RF-ADC, up to 5 GSPS
RF-DAC
8 x 14-bit RF-DAC, up to 9.85 GSPS
PS Processor
Quad-core Arm Cortex-A53 at 1.5 GHz
PS Memory
Up to 8 GB DDR4-2400 x72 with ECC
PL Memory
Up to 8 GB DDR4-2666 x64
eMMC
16 GB eMMC flash (PS)
QSPI Flash
64 MB (PS)
User I/O
202 total: 156 HP (1-1.8 V), 24 HD (1.2-3.3 V), 22 MIO (1.8-3.3 V)
Transceivers
16 x PL GTY up to 28.21 Gbps plus 4 x PS GTR at 6 Gbps
Expansion
5 x ADM6-60 Samtec connectors
PCIe
PCIe Gen4 x8 and Gen2 x4
Ethernet
2 x Gigabit Ethernet PHY (PS + PL)
USB
USB 2.0 PHY; USB 3.0 via PS GTR
Supply
Single 12 V input
Form Factor
Andromeda L, 80 x 64 mm
Operating Temp
Industrial, -40 C to +85 C
Development Kit
Prototype Andromeda XRU50 kit with Neso RF front-end board, base board and accessories
Status
In development - contact vendor for availability
Overview
The Enclustra Andromeda XRU50 RFSoC module packs a full direct-RF signal chain into an 80 x 64 mm system-on-module. Its AMD Zynq UltraScale+ RFSoC device integrates eight 14-bit RF-ADCs to 5 GSPS and eight 14-bit RF-DACs to 9.85 GSPS, allowing direct synthesis and capture of RF signals without discrete analog up/down-conversion stages.
Dual memory banks - up to 8 GB of ECC DDR4 on the processing system and up to 8 GB on the programmable logic - feed the quad-core Cortex-A53 and FPGA fabric respectively, while 16 GB of eMMC and 64 MB of QSPI flash provide non-volatile storage for boot images and application payloads.
With 202 user I/Os, 16 PL GTY transceivers to 28.21 Gbps, PCIe Gen4 x8 and five ADM6-60 Samtec connectors, the module is designed for next-generation wireless and satellite communications, test and measurement, phased-array radar and quantum computing control systems.
Key Benefits
Direct RF synthesis removes analog up/down-conversion hardware. Eight ADC and eight DAC channels serve multi-antenna and phased-array designs from one module. ECC DDR4 on the PS protects control-plane data, while dual PL/PS memory banks keep the FPGA fabric fed. High-speed GTY transceivers and PCIe Gen4 handle backplane and host links, and the 80 x 64 mm industrial-temperature module suits space-constrained, harsh-environment RF systems.
Applications
Software defined radio, 5G and next-generation wireless infrastructure, satellite communications payloads, phased-array radar, test and measurement instrumentation, quantum computing control, and high-speed data acquisition.
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