Specifications
Series
XMC-ZU — configurable Zynq UltraScale+ MPSoC with plug-in I/O
MPN, VITA 42, air-cooled
XMC-ZU5EV1-42-30 (AXM front I/O)
MPN, VITA 42, conduction-cooled
XMC-ZU5EV1-42-50 (rear I/O, no AXM)
MPN, VITA 61, air-cooled
XMC-ZU5EV1-61-30 (AXM front I/O)
MPN, VITA 61, conduction-cooled
XMC-ZU5EV1-61-50 (rear I/O, no AXM)
FPGA / SoC
AMD (Xilinx) Zynq UltraScale+ XCZU5EV MPSoC
Processing System
Quad-core Arm Cortex-A53 application processor plus dual-core Cortex-R5
Dedicated Blocks
On-chip graphics and video encode/decode processing
Companion Series
XMC-FZU — Zynq UltraScale+ with plug-in 10GbE
mini PCIe Variant
APZU-300 AcroPack, 70 mm wide — smallest FPGA mezzanine module
FPGA Fabric Range
XMC, PMC and mPCIe boards up to 410K logic cells
Legacy Families
Artix-7 (XMC-7A), Kintex-7 (XMC-7K), Spartan-6 (XMC-SLX / PMC-SLX)
Memory, Artix/Kintex-7 XMC
128 Meg x 64-bit DDR3 SDRAM plus 32 Meg x 16-bit Flash
High-Speed Serial, P15
Four or eight lanes for PCIe, Serial RapidIO or 10 Gigabit Ethernet
Rear I/O, P4
Two global clock differential pairs plus 30 LVDS signal pairs
Configuration
In-system download over PCIe bus or standard JTAG
Development Kit
Engineering Design Kit with compiled FPGA file and example VHDL
Form Factors
XMC, PMC and mini PCIe (AcroPack) mezzanine
Target Use
Real-time control, sensor fusion, DSP and rugged embedded I/O processing
Overview
Acromag's XMC-ZU Series places an AMD (Xilinx) Zynq UltraScale+ MPSoC on a swappable mezzanine module, combining a quad-core Arm Cortex-A53 application processor, a dual-core Cortex-R5 real-time processor and FPGA fabric in a single device. The result is a module that can run the real-time control and decision logic on ARM cores while the programmable logic handles parallel, latency-critical data movement.
The series is defined by its ordering matrix. The part number encodes the device, the connector standard and the cooling method: XMC-ZU5EV1-42-30 and -61-30 are air-cooled variants with AXM front I/O on VITA 42 and VITA 61 respectively, while XMC-ZU5EV1-42-50 and -61-50 are conduction-cooled with rear I/O and no AXM module. That gives system designers a single architecture that can be specified for a benchtop development chassis or a sealed conduction-cooled military enclosure.
Where higher-speed fabric egress is required, the XMC-FZU Series adds plug-in 10 Gigabit Ethernet. For space-constrained designs, the AcroPack APZU-300 puts the same Zynq UltraScale+ MPSoC on a 70 mm mini PCIe card with an added 100-pin field I/O connector — the smallest FPGA mezzanine module Acromag offers. Acromag's broader FPGA line also spans Artix-7, Kintex-7 and Spartan-6 XMC and PMC modules with up to 410K logic cells, using shared P15/P16/P4 connectors and DDR3 memory maps across families.
Key Benefits
Heterogeneous compute on one module — ARM Cortex-A53 application cores, Cortex-R5 real-time cores and FPGA fabric in an XCZU5EV; four cooling and connector variants in one part-number family for air-cooled and conduction-cooled chassis; reusable design effort through a common Engineering Design Kit with example VHDL and DMA demo code; 10GbE egress via the XMC-FZU companion series; and 70 mm footprint options through the AcroPack APZU-300.
Applications
Real-time industrial control and deterministic I/O processing; sensor fusion and front-end acquisition for radar, imaging and instrumentation; DSP and high-channel-count digital interfaces; data acquisition with change-of-state interrupts; and rugged or conduction-cooled defence and aerospace embedded subsystems.
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