Specifications
SoC
Qualcomm QCS6490 (Dragonwing)
CPU
8-core Qualcomm Kryo 670
GPU
Qualcomm Adreno 643L
NPU
Hexagon 770, 12 TOPS INT8
AI Capability
On-device vision, audio and small-model inference
Cameras
Two cameras integrated on the kit
Wireless
Wi-Fi 6E and Bluetooth 5.x
Operating System
Qualcomm Linux (upstream Yocto based)
Reference Platform
Official Qualcomm RB3 Gen 2 reference design and BSP
Expansion
40-pin low-speed and 60-pin high-speed expansion connectors
Software Stack
Qualcomm AI Hub, TFLite and ONNX runtime support
Target Market
Edge AI, robotics, smart camera, industrial IoT
Overview
The Qualcomm Dragonwing RB3 Gen 2 Development Kit is the official reference platform for the QCS6490 SoC. It pairs an 8-core Kryo 670 CPU and Adreno 643L GPU with a Hexagon 770 NPU rated at 12 TOPS, which is enough to run quantised vision, audio and small language models locally without a discrete accelerator. Two cameras are integrated on the board so a multi-camera vision pipeline can be brought up without external hardware.
Key Benefits
12 TOPS on-device NPU: Hexagon 770 inference for vision, audio and small LLM workloads. Full Qualcomm software stack: Qualcomm Linux BSP plus AI Hub, TFLite and ONNX runtime. Camera-ready: two on-board cameras for immediate multi-stream vision development. Production path: the same QCS6490 silicon is available in commercial modules for volume builds.
Applications
Edge AI gateways and smart-camera products, robotics and AMR perception, industrial machine vision, retail and access-control analytics, medical and laboratory instruments, and IoT devices that need on-device AI with low power and no GPU.
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