Specifications
Platform
NVIDIA Nova Orin (Isaac Nova Orin) reference platform
Compute Module
NVIDIA Jetson AGX Orin 64 GB (also AGX Orin 32 GB option)
AI Performance
Up to 275 TOPS
CPU
12-core NVIDIA Arm Cortex-A78AE v8.2 64-bit
Memory / Storage
Jetson AGX Orin 64 GB LPDDR5 + 64 GB eMMC
Camera
Supports total 8-channel GMSL3.0 / GMSL2.0 with FAKRA connectors
Networking
1x 10GbE + 1x 2.5GbE
USB
3x USB 3.2 Gen 2 (10 Gbit/s)
Fieldbus
2x CANbus
Expansion
1x mPCIe + 2x Nano SIM slots
Robotics Stack
NVIDIA Isaac ROS 2 support; 3D and 2D LiDAR integration
Enclosure
Open-frame carrier design with thermal solution
Dimensions
191 x 209 x 75 mm (without fan); 191 x 209 x 112 mm (with fan)
Installation
Desktop or wall mount
BSP
JetPack 6.0 and above
Certifications
CE / FCC
Part Number
MIC-732D-AO6A1 (AGX Orin 64 GB, 64 GB eMMC)
Overview
The Advantech MIC-732D-AO is an AI developer kit based on the NVIDIA Nova Orin platform, sharing the I/O design of the fanless MIC-732-AO production system but in an open-frame, fan-based enclosure so developers can craft their own thermal solution and application. It embeds an NVIDIA Jetson AGX Orin module delivering up to 275 TOPS.
Built for autonomous mobile robots (AMRs), the MIC-732D-AO supports up to eight GMSL3.0/GMSL2.0 cameras over FAKRA connectors for 360-degree vision, dual CANbus, 10GbE plus 2.5GbE, and the NVIDIA Isaac ROS 2 stack. Combined with 3D and 2D LiDAR integration, it provides a development and evaluation platform for the real-time perception, sensor fusion and navigation workloads at the heart of mobile robotics.
Key Benefits
AMR-ready from the first boot: the MIC-732D-AO packages Jetson AGX Orin compute, eight GMSL camera inputs and Isaac ROS 2 into one open-frame kit, letting teams prototype robot perception and navigation without custom carrier design. It mirrors the MIC-732-AO production system for a smooth path to deployment.
Applications
Autonomous mobile robot (AMR) development, robotics perception prototyping, 360-degree vision and sensor-fusion research, warehouse and logistics robotics, and edge GenAI/robotics R&D.
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