Specifications
Model
Cincoze GM-1100 (GPU Computing — GOLD line)
CPU
Intel 14th / 13th / 12th Gen Core i9 / i7 / i5 / i3
GPU Socket
1x MXM 3.1 expansion socket (Type A and Type B)
GPU Options
MXM-A500 (entry), MXM-A1000, MXM-A2000 (mid), MXM-A4500 (high-end, Type B)
Memory
2x DDR5 SO-DIMM, unbuffered or ECC, up to 64 GB
Storage
NVMe SSD support; 2x M.2 Key B 2242, 1x M.2 Key B 3042/3052
LAN
1x 2.5GbE, 1x 1GbE
USB
1x USB 3.2 Gen2x2 20 Gbps Type-C, 3x USB 3.2 Gen2 10 Gbps Type-A, 4x USB 3.2 Gen1 5 Gbps Type-A
Serial
4x RS-232/422/485
Expansion
2x CMI and 1x CFM module interfaces for I/O, PoE and function expansion
Operating Temperature
-40 °C to 70 °C
Power Input
9-48 VDC wide-range
Chassis
Extruded aluminium, independent CPU/GPU heat channels with external fan
Dimensions
260 x 200 x 85 mm
Mounting
Wall mount, side mount or DIN-rail
Vibration / Shock
MIL-STD-810H compliance
Rail Certification
EN 50121-3-2 rail EMC
Vehicle Certification
E-mark
Awards
2025 Red Dot Design Award; 2026 Taiwan Excellence Award
Upgrade Path
Slide-out MXM module — swap GPU without changing the mechanical design
Overview
The Cincoze GM-1100 puts a real discrete GPU into a DIN-rail-sized industrial enclosure. Rather than soldering the accelerator down, it exposes an MXM 3.1 socket that accepts Type A and Type B modules from the entry-level MXM-A500 through the high-end MXM-A4500 — so a deployed fleet can be re-specified by swapping one module instead of replacing the whole box.
CPU choice spans 14th, 13th and 12th Gen Intel Core processors with up to 64 GB of ECC DDR5, and Cincoze's independent thermal channels route CPU and GPU heat to separate zones of the extruded aluminium chassis to keep both sustained. Native I/O covers dual LAN (2.5GbE plus 1GbE), 20 Gbps USB Type-C and four software-selectable serial ports.
For deployment it is unusually well certified for a GPU-class box: -40 to 70 °C, 9-48 VDC input, MIL-STD-810H vibration and shock, EN 50121-3-2 rail EMC and E-mark vehicle approval. That combination targets autonomous mobile equipment, rolling stock, in-vehicle vision and factory-floor inference where the same design also must survive the next upgrade cycle.
Key Benefits
MXM socket, not a soldered GPU — upgrade accelerator performance in the field and protect the enclosure investment. ECC DDR5 and wide-temperature operation (-40 to 70 °C) suit mission-critical industrial deployments. MIL-STD-810H, EN 50121-3-2 and E-mark clear rail, vehicle and heavy-industry qualification barriers that normally stall a GPU box.
Applications
Autonomous mobile robots (AMR/AGV), in-vehicle AI vision, railway and trackside inference, machine vision inspection, image recognition at the machine, and edge AI nodes in cabinets where a 260 x 200 x 85 mm footprint is the hard constraint.
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