Specifications
Series
ADLINK DLAP expandable edge AI platforms
Models
DLAP-5200, DLAP-4100 and DLAP-8100
Processor
Latest Intel Core processors
GPU Support
MXM or PEG (PCIe Graphics) slots
Certified GPU Performance
Up to 91.1 TFLOPS with NVIDIA RTX 6000 Ada
PCIe Expansion
PCIe Gen4 / Gen5 slots
I/O
USB 3.2 Gen2, 2.5GbE Ethernet, HDMI, DisplayPort, serial and digital I/O
Storage
M.2 expansions and SATA SSD trays
Cooling
Rugged fanless design
Temperature
-20°C to +60°C operation
Ruggedization
Anti-shock and vibration resistance; SWaP optimized
Remote Management
Embedded out-of-band (OOB) module with EdgeGO software
DLAP-5200 Series
High-performance fanless AI IPC on Intel Core Series 2 and 14/13/12th Gen
Form Factor
Compact industrial-grade, SWaP-optimized
Overview
ADLINK's expandable DLAP edge AI platforms comprise three series — DLAP-5200, DLAP-4100 and DLAP-8100 — each built on the latest Intel Core processors with dedicated GPU acceleration through MXM or PEG (PCIe Graphics) slots.
They offer certified GPU support reaching up to 91.1 TFLOPS with NVIDIA RTX 6000 Ada GPUs, and carry comprehensive I/O including USB 3.2 Gen2, 2.5GbE Ethernet, HDMI, DisplayPort, serial and digital I/O, alongside PCIe Gen4/Gen5 slots, M.2 expansions and SATA SSD trays for flexible integration.
The platforms use a rugged, fanless design rated for -20°C to +60°C with anti-shock and vibration resistance, and include an embedded out-of-band module with in-house EdgeGO remote device-management software for 24/7 maintenance. They are SWaP-optimized for edge inference, industrial automation and embedded AI deployments.
Key Benefits
MXM or PEG GPU support scales AI performance at the edge; up to 91.1 TFLOPS with certified RTX 6000 Ada; fanless -20 to +60°C design suits harsh industrial sites; OOB module and EdgeGO enable remote management; PCIe Gen4/Gen5 expansion keeps the platforms future-ready.
Applications
Edge AI inference and machine vision, industrial automation and robotics, autonomous mobile robots, smart manufacturing, transportation and medical/embedded AI platforms.
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